公开(公告)号：US20230327394A1

公开(公告)日：2023-10-12

申请号：US18005876

申请日：2021-07-15

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： Jörg Erich SORG ,  Roland HUETTINGER ,  Matthias HOFMANN ,  Steffen STRAUSS ,  Herbert BRUNNER ,  Ralph WAGNER

IPC: H01S5/02257 ,  H01S5/02224

CPC classification number: H01S5/02257 ,  H01S5/02224 ,  H01S5/4093

Abstract: In one embodiment, the optoelectronic semiconductor component includes at least one optoelectronic semiconductor chip for generating radiation and a housing, in which the at least one optoelectronic semiconductor chip is hermetically encapsulated. The housing includes a housing cover which is secured to a housing main part by a connection means. The housing additionally includes a gas exchange channel which is hermetically sealed by a seal.