公开(公告)号：US20230408895A1

公开(公告)日：2023-12-21

申请号：US18461880

申请日：2023-09-06

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Jörg Erich SORG ,  Nicole BERNER

IPC: G03B21/20 ,  H01S5/40 ,  H01S5/0237 ,  H01S5/0233 ,  H01S5/22 ,  F21V8/00

CPC classification number: G03B21/2033 ,  H01S5/4031 ,  G02B6/002 ,  H01S5/0233 ,  H01S5/22 ,  H01S5/0237

Abstract: The invention relates to a laser projection arrangement. The arrangement includes a sub-mount carrier with a main surface and at least one edge-emitting laser arranged on the sub-mount. The at least one edge-emitting laser is facing the sub-mount and includes at least one laser facet that is located at a predefined distance from the main surface of the sub-mount. A planar light circuit with at least one light guide has an inlet and is arranged on the sub-mount such that the at least one light guide and the inlet is located at the predefined distance from the main surface of the sub-mount facing the at least one laser facet.

公开(公告)号：US20230327394A1

公开(公告)日：2023-10-12

申请号：US18005876

申请日：2021-07-15

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： Jörg Erich SORG ,  Roland HUETTINGER ,  Matthias HOFMANN ,  Steffen STRAUSS ,  Herbert BRUNNER ,  Ralph WAGNER

IPC: H01S5/02257 ,  H01S5/02224

CPC classification number: H01S5/02257 ,  H01S5/02224 ,  H01S5/4093

Abstract: In one embodiment, the optoelectronic semiconductor component includes at least one optoelectronic semiconductor chip for generating radiation and a housing, in which the at least one optoelectronic semiconductor chip is hermetically encapsulated. The housing includes a housing cover which is secured to a housing main part by a connection means. The housing additionally includes a gas exchange channel which is hermetically sealed by a seal.

公开(公告)号：US20220197123A1

公开(公告)日：2022-06-23

申请号：US17129979

申请日：2020-12-22

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Jörg Erich SORG ,  Nicole BERNER

IPC: G03B21/20 ,  H01S5/40 ,  F21V8/00 ,  H01S5/0233 ,  H01S5/22 ,  H01S5/0237

Abstract: The invention relates to a laser projection arrangement. The arrangement includes a sub-mount carrier with a main surface and at least one edge-emitting laser arranged on the sub-mount. The at least one edge-emitting laser is facing the sub-mount and includes at least one laser facet that is located at a predefined distance from the main surface of the sub-mount. A planar light circuit with at least one light guide has an inlet and is arranged on the sub-mount such that the at least one light guide and the inlet is located at the predefined distance from the main surface of the sub-mount facing the at least one laser facet.

公开(公告)号：US20210399518A1

公开(公告)日：2021-12-23

申请号：US17294816

申请日：2019-11-11

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Thomas SCHWARZ ,  Andreas PLÖßL ,  Jörg Erich SORG ,  Frank SINGER

IPC: H01S5/02208 ,  H01S5/02255 ,  H01S5/02 ,  H01S5/02234

Abstract: In one embodiment, the method serves for producing semiconductor lasers and includes the following steps in the order indicated: A) applying a multiplicity of edge emitting laser diodes on a mounting substrate, B) applying an encapsulation element, such that the laser diodes are applied in each case in a cavity between the mounting substrate and the associated encapsulation element, C) operating the laser diodes and determining emission directions of the laser diodes, D) producing material damage in partial regions of the encapsulation element, wherein the partial regions are uniquely assigned to the laser diodes, E) collectively removing material of the encapsulation element, said material being affected by the material damage, with the result that individual optical surfaces for beam shaping arise for the laser diodes in the partial regions, and F) singulating to form the semiconductor lasers.

公开(公告)号：US20210399529A1

公开(公告)日：2021-12-23

申请号：US17291541

申请日：2019-11-05

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Jörg Erich SORG ,  Jan MARFELD ,  Stefan MORGOTT

IPC: H01S5/40 ,  H01S5/026 ,  H01S5/028

Abstract: A semiconductor laser includes an edge-emitting laser diode, which has an active zone for generating laser radiation and a facet having a radiation exit region, and at least one photodiode. The facet is arranged on a main emission side of the laser diode. The photodiode is arranged in such a way that at least part of the laser radiation exiting at the facet reaches the photodiode. The laser diode and the photodiode are not connected to each other in a non-destructively detachable manner, and a non-destructively detachable connection is formed with a joining partner