ELECTRONIC COMPONENT AND METHOD FOR MOUNTING AN ELECTRONIC COMPONENT

    公开(公告)号:US20220166184A1

    公开(公告)日:2022-05-26

    申请号:US17602334

    申请日:2020-03-19

    Abstract: The invention relates to a component comprising: a semiconductor chip; a casing material which at least partially surrounds the semiconductor chip; a protective layer which is formed with a material that is different from the casing material; wherein a side of the casing material facing away from the semiconductor chip is covered by the protective layer at least in places. The invention also relates to a method for assembling an electronic component.

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