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公开(公告)号：US11502228B2
公开(公告)日：2022-11-15
申请号：US16629422
申请日：2017-08-04
IPC分类号： H01L33/56 , H01S5/02218 , H01S5/0235 , H01L33/50 , H01L33/60 , H01L33/62
摘要： A method of producing an optoelectronic semiconductor device includes providing a frame part including a plurality of openings, providing an auxiliary carrier, connecting the auxiliary carrier to the frame part such that the auxiliary carrier covers at least some of the openings at an underside of the frame part, placing conversion elements onto the auxiliary carrier in at least some of the openings, placing optoelectronic semiconductor chips onto the conversion elements in at least some of the openings, applying a housing onto the conversion elements and around the semiconductor chips in at least some of the openings, and removing the frame part and the auxiliary carrier wherein a bottom surface of at least some of the optoelectronic semiconductor chips remains free of the housing.
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公开(公告)号：US20210119091A1
公开(公告)日：2021-04-22
申请号：US16629422
申请日：2017-08-04
IPC分类号： H01L33/56 , H01L33/50 , H01L33/60 , H01L33/62 , H01S5/0235 , H01S5/02218
摘要： A method of producing an optoelectronic semiconductor device includes providing a frame part including a plurality of openings, providing an auxiliary carrier, connecting the auxiliary carrier to the frame part such that the auxiliary carrier covers at least some of the openings at an underside of the frame part, placing conversion elements onto the auxiliary carrier in at least some of the openings, placing optoelectronic semiconductor chips onto the conversion elements in at least some of the openings, applying a housing onto the conversion elements and around the semiconductor chips in at least some of the openings, and removing the frame part and the auxiliary carrier wherein a bottom surface of at least some of the optoelectronic semiconductor chips remains free of the housing.
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