公开(公告)号：US11107958B2

公开(公告)日：2021-08-31

申请号：US16489393

申请日：2018-03-19

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Tobias Gebuhr ,  Markus Burger ,  Markus Boß ,  Markus Pindl

IPC: H01L33/54 ,  H01L25/075 ,  H01L33/62

Abstract: A method of producing optoelectronic semiconductor components includes A) providing a chip carrier with electrical conductor structures on a carrier upper side, B) applying at least one semi-conductor chip configured to produce light on at least one of the electrical conductor structures, C) applying at least one sealing structure to at least one of the electrical conductor structures so that the sealing structure completely surrounds at least one contact area when viewed from the top, and D) producing a mold body directly at the at least one semiconductor chip and directly at the at least one sealing structure by transfer molding or injection molding, wherein, in an injection mold, the at least one sealing structure seals the at least one contact area against a material of the mold body so that the at least one contact area remains free of the mold body.