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    Method for Producing at Least One Optoelectronic Component, and Optoelectronic Component
    2.
    发明申请
    Method for Producing at Least One Optoelectronic Component, and Optoelectronic Component 审中-公开

    公开(公告)号：US20200075818A1

    公开(公告)日：2020-03-05

    申请号：US16491146

    申请日：2018-03-06

    Applicant: OSRAM Opto Semiconductors GmbH

    Inventor： Markus Pindl ,  Markus Burger ,  Markus Boss ,  Matthias Lermer

    IPC: H01L33/54 ,  H01L33/56 ,  H01L33/50

    Abstract: A method for producing at at least an optoelectronic component and an optoelectronic component are disclosed. In an embodiment a method includes providing a substrate having at least one aperture, applying at least one semiconductor chip to the substrate, arranging barrier structures provided that the barrier structures are not already part of the substrate, wherein the semiconductor chip is spaced apart from the barrier structures as seen in a side cross-section, applying an auxiliary carrier at least to a main radiation exit surface and to the barrier structures, introducing a casting material via the at least one aperture in the substrate so that the casting material is arranged between the barrier structures and the semiconductor chip and between the substrate and the auxiliary carrier, and curing the casting material.

    Method of producing optoelectronic semiconductor components
    4.
    发明授权
    Method of producing optoelectronic semiconductor components 有权

    公开(公告)号：US11107958B2

    公开(公告)日：2021-08-31

    申请号：US16489393

    申请日：2018-03-19

    Applicant: OSRAM Opto Semiconductors GmbH

    Inventor： Tobias Gebuhr ,  Markus Burger ,  Markus Boß ,  Markus Pindl

    IPC: H01L33/54 ,  H01L25/075 ,  H01L33/62

    Abstract: A method of producing optoelectronic semiconductor components includes A) providing a chip carrier with electrical conductor structures on a carrier upper side, B) applying at least one semi-conductor chip configured to produce light on at least one of the electrical conductor structures, C) applying at least one sealing structure to at least one of the electrical conductor structures so that the sealing structure completely surrounds at least one contact area when viewed from the top, and D) producing a mold body directly at the at least one semiconductor chip and directly at the at least one sealing structure by transfer molding or injection molding, wherein, in an injection mold, the at least one sealing structure seals the at least one contact area against a material of the mold body so that the at least one contact area remains free of the mold body.

    Method of producing a conversion element
    6.
    发明授权
    Method of producing a conversion element 有权

    公开(公告)号：US09773956B2

    公开(公告)日：2017-09-26

    申请号：US14896950

    申请日：2014-06-06

    Applicant: OSRAM Opto Semiconductors GmbH

    Inventor： Markus Richter ,  Markus Burger

    IPC: B05D1/32 ,  H01L33/50 ,  B05D3/02

    CPC classification number: H01L33/505 ,  B05D1/32 ,  B05D1/322 ,  B05D3/02 ,  H01L33/50 ,  H01L2933/0041

    Abstract: A method of producing a conversion element includes providing a substrate having a surface; forming a first mask structure above the surface, wherein the first mask structure has first webs and first openings arranged between the first webs and the first openings form cavities in which the surface of the substrate is accessible; arranging a second mask structure above the first mask structure, wherein the second mask structure has second webs and second openings arranged between the second webs, the first webs are at least partly covered by the second webs, and the cavities remain at least partly accessible through the second openings; spraying a material into the cavities through the second openings; removing the second mask structure; and removing the first mask structure.

    WHITE LIGHT SOURCE AND METHOD OF PRODUCING A WHITE LIGHT SOURCE
    8.
    发明申请
    WHITE LIGHT SOURCE AND METHOD OF PRODUCING A WHITE LIGHT SOURCE 审中-公开

    公开(公告)号：US20190319018A1

    公开(公告)日：2019-10-17

    申请号：US16469728

    申请日：2017-12-14

    Applicant: OSRAM Opto Semiconductors GmbH

    Inventor： Markus Burger ,  Désirée Queren

    IPC: H01L25/075 ,  H01L33/50

    Abstract: A white light source includes an arrangement of light-emitting diodes, wherein the light-emitting diodes are subdivided into first light-emitting diodes and second light-emitting diodes, and a conversion element configured to absorb light emitted by the light-emitting diodes and generate converted light with a longer wavelength than the emitted light, wherein the conversion element includes a first luminescent conversion material in a first matrix material, the first matrix material with the first luminescent conversion material is arranged two-dimensionally in a continuous layer above the first and second light-emitting diodes, the conversion element includes a second luminescent conversion material in a second matrix material, and the second matrix material with the second luminescent conversion material is arranged only above the second light-emitting diodes.

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