公开(公告)号：US20230042041A1

公开(公告)日：2023-02-09

申请号：US17792679

申请日：2020-12-18

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Karlheinz ARNDT ,  Matthias GOLDBACH ,  Simon JEREBIC ,  Matthias HOFMANN ,  Markus BOSS ,  Constantin HETZER ,  Harald JAEGER ,  Jens EBERHARD ,  Sebastian STOLL

IPC: H01L33/48 ,  H01L33/62 ,  H01L33/10 ,  H01L33/00 ,  H01L33/56

Abstract: The Invention relates to a housing for an optoelectronic semiconductor component, comprising: a housing main body, which has a chip mounting side, at least two electrical conducting structures in and/or on the housing main body, and a plurality of drainage structures on the chip mounting side. The electrical conducting structures form, on the chip mounting side, electrical contact surfaces for at least one optoelectronic semiconductor chip and the drainage structure are designed as means for feeding a liquid potting material to the electrical contact surfaces.