公开(公告)号：US20160254415A1

公开(公告)日：2016-09-01

申请号：US15030359

申请日：2014-10-14

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： Mathias KAEMPF ,  Simon JEREBIC ,  Ingo NEUDECKER ,  Guenter SPATH ,  Michael HUBER

IPC: H01L33/48 ,  H01L33/56 ,  H01L33/62 ,  H01L33/54 ,  H01L33/60 ,  H01L33/00

CPC classification number: H01L33/486 ,  H01L24/32 ,  H01L33/0095 ,  H01L33/20 ,  H01L33/54 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/73265 ,  H01L2924/10156 ,  H01L2933/0033

Abstract: The invention relates to an optoelectronic semiconductor chip (10) comprising a carrier (2) and a semiconductor body (1) having an active layer (13) provided for generating electromagnetic radiation. Said carrier (2) has a first main surface (2A) facing the semiconductor body, a second main surface (2B) facing away from the semiconductor body, and a sidewall (2C) arranged between the first main surface and the second main surface. The carrier (2) has a structured region (21, 22, 23, 2C) for enlarging the total surface area of the sidewall, wherein the structured region has singulation traces. The invention also relates to an optoelectronic component (100) comprising such a semiconductor chip and a method for producing a plurality of such semiconductor chips are specified.

Abstract translation: 本发明涉及一种包括载体（2）和具有用于产生电磁辐射的有源层（13）的半导体本体（1）的光电半导体芯片（10）。 所述载体（2）具有面向半导体主体的第一主表面（2A），背离半导体主体的第二主表面（2B）和布置在第一主表面和第二主表面之间的侧壁（2C）。 载体（2）具有用于扩大侧壁的总表面积的结构化区域（21,22,23,2C），其中结构化区域具有单一迹线。 本发明还涉及包含这种半导体芯片的光电子部件（100）和制造多个这种半导体芯片的方法。

公开(公告)号：US20230042041A1

公开(公告)日：2023-02-09

申请号：US17792679

申请日：2020-12-18

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Karlheinz ARNDT ,  Matthias GOLDBACH ,  Simon JEREBIC ,  Matthias HOFMANN ,  Markus BOSS ,  Constantin HETZER ,  Harald JAEGER ,  Jens EBERHARD ,  Sebastian STOLL

IPC: H01L33/48 ,  H01L33/62 ,  H01L33/10 ,  H01L33/00 ,  H01L33/56

Abstract: The Invention relates to a housing for an optoelectronic semiconductor component, comprising: a housing main body, which has a chip mounting side, at least two electrical conducting structures in and/or on the housing main body, and a plurality of drainage structures on the chip mounting side. The electrical conducting structures form, on the chip mounting side, electrical contact surfaces for at least one optoelectronic semiconductor chip and the drainage structure are designed as means for feeding a liquid potting material to the electrical contact surfaces.

公开(公告)号：US20180233627A1

公开(公告)日：2018-08-16

申请号：US15514814

申请日：2015-10-07

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Mathias KAEMPF ,  Simon JEREBIC ,  Ingo NEUDECKER ,  Guenter SPATH ,  Michael HUBER ,  Korbinian PERZLMAIER

IPC: H01L33/22 ,  H01L33/00

CPC classification number: H01L33/22 ,  H01L33/0095 ,  H01L33/20

Abstract: Disclosed is a radiation-emitting semi-conductor chip (1) comprising an epitaxial semi-conductor layer sequence (3) which emits electromagnetic radiation in operation. The epitaxial semi-conductor layer sequence (3) is applied on a a transparent substrate (4), wherein the substrate (4) has a first main surface (8) facing the semi-conductor layer sequence (3), a second main surface (9) facing away from the semi-conductor layer sequence (3) and a first lateral flank (10) arranged between the first main surface (8) and the second main surface (9), and the lateral flank (10) has a decoupling structure which is formed in a targeted manner from separating tracks. Also disclosed is a method for producing the semi-conductor chip, and a component comprising such a semi-conductor chip.

公开(公告)号：US20220263001A1

公开(公告)日：2022-08-18

申请号：US17627569

申请日：2020-07-29

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Karlheinz ARNDT ,  Tobias GEBUHR ,  Simon JEREBIC

IPC: H01L33/62 ,  H01L33/00

Abstract: The invention relates to a housing for a radiation-emitting component, having the following features: —at least one electric contact point which is arranged on a first main surface of the housing and—at least one depression in the first main surface of the housing, said depression being arranged adjacently to the electric contact point. The invention additionally relates to a method for producing a radiation-emitting component and to a radiation-emitting component.