公开(公告)号：US20230042041A1

公开(公告)日：2023-02-09

申请号：US17792679

申请日：2020-12-18

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Karlheinz ARNDT ,  Matthias GOLDBACH ,  Simon JEREBIC ,  Matthias HOFMANN ,  Markus BOSS ,  Constantin HETZER ,  Harald JAEGER ,  Jens EBERHARD ,  Sebastian STOLL

IPC: H01L33/48 ,  H01L33/62 ,  H01L33/10 ,  H01L33/00 ,  H01L33/56

Abstract: The Invention relates to a housing for an optoelectronic semiconductor component, comprising: a housing main body, which has a chip mounting side, at least two electrical conducting structures in and/or on the housing main body, and a plurality of drainage structures on the chip mounting side. The electrical conducting structures form, on the chip mounting side, electrical contact surfaces for at least one optoelectronic semiconductor chip and the drainage structure are designed as means for feeding a liquid potting material to the electrical contact surfaces.

公开(公告)号：US20220093831A1

公开(公告)日：2022-03-24

申请号：US17424719

申请日：2020-03-12

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Jens EBERHARD ,  Andreas HANISCH

IPC: H01L33/50 ,  C09K11/02 ,  H01L33/00 ,  C09K11/70

Abstract: A conversion particle is specified comprising a core formed with a phosphor, a shell formed with a polysiloxane, wherein the shell has a layer thickness of between at least 1 micrometer and at most 15 micrometers. Furthermore, a conversion element and an optoelectronic component comprising such a conversion particle are specified. In addition, a method for producing a conversion particle is specified.