公开(公告)号：US11694977B2

公开(公告)日：2023-07-04

申请号：US17046209

申请日：2019-05-08

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Simeon Katz ,  Sophia Huppmann ,  Michael Hoenle ,  Thorsten Wagner ,  Kurt Hingerl

IPC: H01L23/48 ,  H01L23/00

CPC classification number: H01L24/05 ,  H01L24/03 ,  H01L24/80 ,  H01L2224/05025 ,  H01L2224/05551 ,  H01L2224/80896 ,  H01L2224/80904

Abstract: In an embodiment a method includes providing the first component part with a partially exposed first insulating layer, a plurality of first through-vias and an exposed first contact layer structured in places and planarized in places, wherein the first through-vias are each laterally enclosed by the first insulating layer, and wherein the first contact layer partially covers the first insulating layer and completely covers the first through-vias; providing the second component part with a partially exposed second insulating layer, a plurality of second through-vias and an exposed second contact layer structured in places and planarized in places, wherein the second through-vias are each laterally enclosed by the second insulating layer, and wherein the second contact layer partially covers the second insulating layer and completely covers the second through-vias and joining the component parts such that the contact layers overlap each other thereby mechanically and electrically connecting the component parts to each other by a direct bonding process at the contact layers.

公开(公告)号：US20210035934A1

公开(公告)日：2021-02-04

申请号：US17046209

申请日：2019-05-08

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Simeon Katz ,  Sophia Huppmann ,  Michael Hoenle ,  Thorsten Wagner ,  Kurt Hingerl

IPC: H01L23/00

Abstract: In an embodiment a method includes providing the first component part with a partially exposed first insulating layer, a plurality of first through-vias and an exposed first contact layer structured in places and planarized in places, wherein the first through-vias are each laterally enclosed by the first insulating layer, and wherein the first contact layer partially covers the first insulating layer and completely covers the first through-vias; providing the second component part with a partially exposed second insulating layer, a plurality of second through-vias and an exposed second contact layer structured in places and planarized in places, wherein the second through-vias are each laterally enclosed by the second insulating layer, and wherein the second contact layer partially covers the second insulating layer and completely covers the second through-vias and joining the component parts such that the contact layers overlap each other thereby mechanically and electrically connecting the component parts to each other by a direct bonding process at the contact layers.