公开(公告)号：US20170137328A1

公开(公告)日：2017-05-18

申请号：US15320110

申请日：2015-06-17

Applicant: OSRAM SYLVANIA INC.

Inventor： John F. Kelso ,  Alan Lenef ,  Alan Piquette

IPC: C04B37/00 ,  B32B37/06 ,  B32B7/12 ,  C09K11/77 ,  B32B18/00

CPC classification number: C04B37/005 ,  B32B7/12 ,  B32B18/00 ,  B32B37/06 ,  B32B2307/40 ,  B32B2315/02 ,  B32B2551/00 ,  C04B37/001 ,  C04B2235/5445 ,  C04B2237/062 ,  C04B2237/343 ,  C04B2237/59 ,  C04B2237/708 ,  C09K11/7774 ,  H01L33/501 ,  H01L33/502 ,  H01L33/507 ,  H01L2933/0041 ,  H01S5/005

Abstract: There is herein described a method for forming a ceramic wavelength converter assembly which achieves a direct bonding of an alumina-based ceramic wavelength converter to an alumina-based ceramic substrate such as polycrystalline or sapphire. The method comprises applying a silica-containing layer between the converter and the substrate and then applying heat to bond the converter to the substrate to form the ceramic wavelength converter assembly. Because direct bonding is achieved, the ceramic wavelength converter may operate at much higher incident light powers than conventional silicone glue-bonded converters.