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公开(公告)号：US10039194B2
公开(公告)日：2018-07-31
申请号：US14415676
申请日：2013-08-01
Applicant: OSRAM SYLVANIA Inc.
Inventor： Jeffery Serre , Alan Lenef , Adam Scotch
CPC classification number: H05K3/3431 , B23K1/0016 , B23K1/20 , B23K3/0684 , H01L24/29 , H01L24/32 , H01L24/83 , H01L24/95 , H01L24/97 , H01L33/62 , H01L2224/29082 , H01L2224/29105 , H01L2224/29113 , H01L2224/325 , H01L2224/83143 , H01L2224/83192 , H01L2224/8321 , H01L2224/83815 , H01L2224/83907 , H01L2224/9205 , H01L2224/95085 , H01L2224/95101 , H01L2224/95146 , H01L2224/97 , H01L2924/01322 , H05K1/111 , H05K3/3468 , H05K13/0465 , H05K2201/10992 , H05K2203/044 , H05K2203/047 , H05K2203/048 , H01L2924/00012 , H01L2924/0105
Abstract: A dual solder layer for fluidic self assembly, an electrical component substrate, and method employing same is described. The dual solder layer comprises a layer of a self-assembly solder disposed on a layer of a base solder which is disposed on the solder pad of an electrical component substrate. The self-assembly solder has a liquidus temperature less than a first temperature and the base solder has a solidus temperature greater than the first temperature. The self-assembly solder liquefies at the first temperature during a fluidic self assembly method to cause electrical components to adhere to the substrate. After attachment, the substrate is removed from the bath and heated so that the base solder and self-assembly solder combine to form a composite alloy which forms the final electrical solder connection between the component and the solder pad on the substrate.
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公开(公告)号：US20170015901A1
公开(公告)日：2017-01-19
申请号：US15113239
申请日：2015-01-26
Applicant: OSRAM SYLVANIA INC. , OSRAM GMBH
Inventor： Alan Lenef , James Avallon , John Kelso , Maxim Tchoul , Yi Zheng , Oliver Mehl , Peter Hoehmann , Markus Stange , Tobias Gleitsmann
CPC classification number: C09K11/7774 , C04B37/028 , C04B2237/16 , C04B2237/343 , C04B2237/36 , C04B2237/40 , C04B2237/708 , C08K3/22 , C08K2003/2296 , C09J183/04 , C09J2205/102 , C09K11/0883 , C09K11/7734 , G02B7/008 , G03B21/204 , H01S3/005 , H01S5/005 , H01S5/32341
Abstract: There is herein described a ceramic phosphor target which may be used in a laser-activated remote phosphor application. The target comprises a substantially flat ceramic phosphor converter comprised of a photoluminescent polycrystalline ceramic which is attached to a reflective metal substrate by a high thermal conductivity adhesive.
Abstract translation: 这里描述了可用于激光激活的远程荧光体应用中的陶瓷荧光体靶。 目标包括由光致发光多晶陶瓷组成的基本平坦的陶瓷荧光转换器，该陶瓷荧光转换器通过高导热性粘合剂附着到反射金属基底上。
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公开(公告)号：US20160369954A1
公开(公告)日：2016-12-22
申请号：US15118075
申请日：2015-03-10
Applicant: OSRAM SYLVANIA INC.
Inventor： Maria Anc , Alan Lenef
CPC classification number: H01L33/642 , B32B3/02 , B32B3/10 , B32B3/266 , B32B7/027 , B32B7/04 , B32B7/12 , B32B15/04 , B32B15/043 , B32B15/20 , B32B18/00 , B32B2250/44 , B32B2255/20 , B32B2255/205 , B32B2255/28 , B32B2307/302 , B32B2307/412 , B32B2307/416 , B32B2307/422 , B32B2311/08 , B32B2311/12 , B32B2311/24 , B32B2315/02 , C04B35/115 , C04B2237/12 , C04B2237/121 , C04B2237/124 , C04B2237/125 , C04B2237/16 , C04B2237/343 , C04B2237/592 , C04B2237/72 , C04B2237/86 , F21K9/64 , F21V29/83 , F21Y2115/30 , H01L33/501 , H01L33/502 , H01L33/505 , H01L33/507 , H01L33/508 , H01L33/644 , Y10S428/913 , Y10T428/24322 , Y10T428/24331 , Y10T428/24752 , Y10T428/24777 , Y10T428/24802 , Y10T428/24843 , Y10T428/24851 , Y10T428/24917 , Y10T428/24926 , Y10T428/24942
Abstract: The present disclosure is directed to light converter assemblies with enhanced heat dissipation. A light converter assembly may comprise a confinement material applied to at least a first substrate and a phosphor material also deposited on the first substrate so as to be surrounded by the confinement material. The first substrate may be hermetically sealed to a second substrate using the confinement material so that the phosphor material is confined between the substrates and protected from atmospheric contamination. The substrates may comprise, for example, sapphire to allow for light beam transmission and heat conductance. Confinement materials that may be employed to seal the first substrate to the second substrate may include, for example, silicon or a metal (e.g., silver, copper, aluminum, etc.) The phosphor material may comprise, for example, at least one quantum dot material.
Abstract translation: 本公开涉及具有增强的散热的光转换器组件。 光转换器组件可以包括施加到至少第一衬底的限制材料和也沉积在第一衬底上以便被限制材料包围的荧光体材料。 第一基底可以使用约束材料与第二基底气密密封，使得荧光体材料被限制在基底之间并且防止大气污染。 衬底可以包括例如蓝宝石以允许光束透射和热传导。 可以用于将第一衬底密封到第二衬底的限制材料可以包括例如硅或金属（例如，银，铜，铝等）。磷光体材料可以包括例如至少一个量子 点材料。
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Patent Agency Ranking
公开(公告)号：US20180026168A1
公开(公告)日：2018-01-25
申请号：US15546909
申请日：2016-02-12
Applicant: OSRAM SYLVANIA Inc.
Inventor： Alan Lenef , David Hamby , James Avallon
IPC: H01L33/60 , H01L33/56 , H01L25/075
CPC classification number: H01L33/60 , H01L25/0753 , H01L33/56 , H01L2933/0091
Abstract: There is herein described a light source that homogenizes the light produced by a large area array of forward directed LEDs mounted on highly reflective substrate, while achieving a low-profile form factor and maintaining high efficacy. The LED light source employs a diffuser comprised of two diffusing layers: a low scattering diffusing layer bonded to the LEDs and a high scattering diffusing layer that is bonded to the low scattering diffusing layer. The LED light source achieves good diffuse illumination with a thin diffuser by making use of a light channeling effect between the highly reflective substrate and the high backscattering from the high scattering diffusing layer.
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公开(公告)号：US20160334552A1
公开(公告)日：2016-11-17
申请号：US15112487
申请日：2015-01-26
Applicant: OSRAM SYLVANIA INC.
Inventor： Alan Lenef , James Avallon , Adam Scotch
CPC classification number: G02B5/0858 , C04B37/026 , C04B2237/062 , C04B2237/121 , C04B2237/125 , C04B2237/343 , C04B2237/407 , C04B2237/708 , C04B2237/72 , C09K11/0883 , C09K11/7734 , C09K11/7774 , G02B7/1815 , H01L33/505 , H01L33/60
Abstract: There is herein described a ceramic wavelength converter having a high reflectivity reflector. The ceramic wavelength converter is capable of converting a primary light into a secondary light and the reflector comprises a reflective metal layer and a dielectric buffer layer between the ceramic wavelength converter and the reflective metal layer. The buffer layer is non-absorbing with respect to the secondary light and has an index of refraction that is less than an index of refraction of the ceramic wavelength converter. Preferably the reflectivity of the reflector is at least 80%, more preferably at least 85% and even more preferably at least 95% with respect to the secondary light emitted by the converter.
Abstract translation: 这里描述了具有高反射率反射器的陶瓷波长转换器。 陶瓷波长转换器能够将一次光转换成二次光，反射器包括反射金属层和陶瓷波长转换器与反射金属层之间的介质缓冲层。 缓冲层相对于次级光不吸收，并且具有小于陶瓷波长转换器的折射率的折射率。 优选地，反射器的反射率相对于由转换器发射的次级光是至少80％，更优选至少85％，甚至更优选至少95％。
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公开(公告)号：US20190186711A1
公开(公告)日：2019-06-20
申请号：US16309111
申请日：2017-06-09
Applicant: OSRAM SYLVANIA Inc. , OSRAM GmbH
Inventor： Alan Lenef , Angela Eberhardt , Florian Peskoller , David Johnston , Jöerg Sorg , James Avallon , John Kelso , Madis Raukas , Joachim Wirth-Schön , Dennis Sprenger
IPC: F21V7/30
CPC classification number: F21V7/30 , F21Y2115/30 , G03B21/204
Abstract: Techniques for bonding a luminescent material to a thermally conductive substrate using a low temperature glass to provide a wavelength converter system are provided. A dichroic coating is deposited on a thermally conductive substrate. The dichroic coating includes alternating layers of a first material having a first refractive index and a second material having a second refractive index which is greater than the first refractive index. A buffer layer is deposited on the dichroic coating. A wavelength converter is bonded to the buffer layer by a layer of low temperature glass. In some embodiments, the wavelength converter includes a phosphor for converting a primary light from an excitation source into a secondary light.
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公开(公告)号：US20170137328A1
公开(公告)日：2017-05-18
申请号：US15320110
申请日：2015-06-17
Applicant: OSRAM SYLVANIA INC.
Inventor： John F. Kelso , Alan Lenef , Alan Piquette
CPC classification number: C04B37/005 , B32B7/12 , B32B18/00 , B32B37/06 , B32B2307/40 , B32B2315/02 , B32B2551/00 , C04B37/001 , C04B2235/5445 , C04B2237/062 , C04B2237/343 , C04B2237/59 , C04B2237/708 , C09K11/7774 , H01L33/501 , H01L33/502 , H01L33/507 , H01L2933/0041 , H01S5/005
Abstract: There is herein described a method for forming a ceramic wavelength converter assembly which achieves a direct bonding of an alumina-based ceramic wavelength converter to an alumina-based ceramic substrate such as polycrystalline or sapphire. The method comprises applying a silica-containing layer between the converter and the substrate and then applying heat to bond the converter to the substrate to form the ceramic wavelength converter assembly. Because direct bonding is achieved, the ceramic wavelength converter may operate at much higher incident light powers than conventional silicone glue-bonded converters.
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8.发明申请DUAL SOLDER LAYER FOR FLUIDIC SELF ASSEMBLY AND ELECTRICAL COMPONENT SUBSTRATE AND METHOD EMPLOYING SAME 审中-公开用于流体自组装和电气部件基板的双金属层及其使用方法公开(公告)号：US20150223346A1
公开(公告)日：2015-08-06
申请号：US14415676
申请日：2013-08-01
Applicant: OSRAM SYLVANIA INC.
Inventor： Jeffery Serre , Alan Lenef , Adam Scotch
CPC classification number: H05K3/3431 , B23K1/0016 , B23K1/20 , B23K3/0684 , H01L24/29 , H01L24/32 , H01L24/83 , H01L24/95 , H01L24/97 , H01L33/62 , H01L2224/29082 , H01L2224/29105 , H01L2224/29113 , H01L2224/325 , H01L2224/83143 , H01L2224/83192 , H01L2224/8321 , H01L2224/83815 , H01L2224/83907 , H01L2224/9205 , H01L2224/95085 , H01L2224/95101 , H01L2224/95146 , H01L2224/97 , H01L2924/01322 , H05K1/111 , H05K3/3468 , H05K13/0465 , H05K2201/10992 , H05K2203/044 , H05K2203/047 , H05K2203/048 , H01L2924/00012 , H01L2924/0105
Abstract: A dual solder layer for fluidic self assembly, an electrical component substrate, and method employing same is described. The dual solder layer comprises a layer of a self-assembly solder disposed on a layer of a base solder which is disposed on the solder pad of an electrical component substrate. The self-assembly solder has a liquidus temperature less than a first temperature and the base solder has a solidus temperature greater than the first temperature. The self-assembly solder liquefies at the first temperature during a fluidic self assembly method to cause electrical components to adhere to the substrate. After attachment, the substrate is removed from the bath and heated so that the base solder and self-assembly solder combine to form a composite alloy which forms the final electrical solder connection between the component and the solder pad on the substrate.
Abstract translation: 描述了用于流体自组装的双焊料层，电组件衬底和使用其的方法。 双焊料层包括设置在基底焊料层上的自组装焊料层，其设置在电组件衬底的焊盘上。 自组装焊料具有低于第一温度的液相线温度，并且基底焊料的固相线温度大于第一温度。 在流体自组装方法期间，自组装焊料在第一温度下液化，以使电组件粘附到衬底上。 附着后，将衬底从浴中取出并加热，使得基底焊料和自组装焊料组合形成复合合金，其形成组件和衬底上的焊盘之间的最终电焊接连接。
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