公开(公告)号：US11685649B2

公开(公告)日：2023-06-27

申请号：US16982519

申请日：2019-03-20

Applicant: Obsidian Sensors, Inc.

Inventor： John Hong ,  Tallis Chang ,  Edward Chan ,  Bing Wen ,  Yaoling Pan ,  Kenji Nomura

IPC: B81C1/00 ,  B81B7/00 ,  G01J5/20

CPC classification number: B81C1/00269 ,  B81B7/0038 ,  B81C1/00285 ,  B81C2203/019 ,  B81C2203/0118 ,  B81C2203/035 ,  B81C2203/05 ,  G01J5/20

Abstract: A method of manufacturing MEMS housings includes: providing glass spacers; providing a window plate; attaching the window plate to the glass spacers; aligning the glass spacers with a device glass plate having MEMS devices thereon; bonding the glass spacers to the device glass plate; and singulating the glass spacers, window plate, and device glass plate to produce the MEMS housings.