公开(公告)号：US20190161345A1

公开(公告)日：2019-05-30

申请号：US15827057

申请日：2017-11-30

申请人： Infineon Technologies AG

发明人： Florian BRANDL ,  Manfred FRIES ,  Franz-Peter KALZ

IPC分类号： B81C1/00 ,  H01L21/50 ,  H01L23/04 ,  H01L23/10 ,  B81B7/00

CPC分类号： B81C1/00285 ,  B29C35/02 ,  B81B7/0029 ,  B81B7/0038 ,  B81B7/0045 ,  B81B7/0051 ,  B81C1/00063 ,  B81C1/0019 ,  B81C1/00301 ,  B81C1/0038 ,  B81C1/00904 ,  H01L21/50 ,  H01L23/04 ,  H01L23/10 ,  H01L2924/16235

摘要： A semiconductor device and a method of manufacturing the same are provided such that a microelectromechanical systems (MEMS) element is protected at an early manufacturing stage. A method for protecting a MEMS element includes: providing at least one MEMS element, having a sensitive area, on a substrate; and depositing, prior to a package assembly process, a protective material over the sensitive area of the at least one MEMS element such that the sensitive area of at least one MEMS element is sealed from an external environment, where the protective material permits a sensor functionality of the at least one MEMS element.

公开(公告)号：US20190077656A1

公开(公告)日：2019-03-14

申请号：US15698706

申请日：2017-09-08

申请人： TEXAS INSTRUMENTS INCORPORATED

发明人： Benjamin Stassen COOK ,  Kurt WACHTLER ,  Adam Joseph FRUEHLING ,  Juan Alejandro HERBSOMMER ,  Simon Joshua JACOBS

IPC分类号： B81C1/00 ,  G04F5/14

CPC分类号： B81C1/00793 ,  B81B3/0089 ,  B81B7/0038 ,  B81B2201/058 ,  B81B2203/0315 ,  G04F5/14 ,  H01L21/00

摘要： Methods for depositing a measured amount of a species in a sealed cavity. In one example, a method for depositing molecules in a sealed cavity includes depositing a selected number of microcapsules in a cavity. Each of the microcapsules contains a predetermined amount of a first fluid. The cavity is sealed after the microcapsules are deposited. After the cavity is sealed the microcapsules are ruptured to release molecules of the first fluid into the cavity.

公开(公告)号：US20180362337A1

公开(公告)日：2018-12-20

申请号：US15781777

申请日：2016-10-12

申请人： Robert Bosch GmbH

发明人： Achim Breitling ,  Mawuli Ametowobla

IPC分类号： B81C1/00 ,  B81B7/00 ,  G01P1/02

CPC分类号： B81C1/00285 ,  B81B7/0038 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2203/0315 ,  B81C2203/0145 ,  G01P1/02

摘要： A method for producing a micromechanical component having a substrate and cap, which is connected to the substrate and encloses a first cavity therewith. A first pressure prevails in the first cavity, and a first gas mixture having a first chemical composition is enclosed, and an access opening is provided in the substrate or cap, which connects the first cavity to an environment of the micromechanical component, and then the first pressure and/or the first chemical composition is adjusted in the first cavity, and finally, the access opening is sealed with a laser by introducing energy/heat into an absorbing part of the substrate or cap, and a getter, introduced into the first cavity prior to the third task, is sealed with the laser radiation, and a getter, introduced into the first cavity prior to the third task, is activated at least partially with the laser radiation, during the third task.

公开(公告)号：US10081537B2

公开(公告)日：2018-09-25

申请号：US15354682

申请日：2016-11-17

申请人： Kathirgamasundaram Sooriakumar ,  Anu Austin ,  Ian Rose Bihag

发明人： Kathirgamasundaram Sooriakumar ,  Anu Austin ,  Ian Rose Bihag

IPC分类号： H04R19/04 ,  B81B7/00 ,  H04R1/44 ,  H04R1/04 ,  H04R1/28 ,  H04R17/02 ,  H04R19/00

CPC分类号： B81B7/0061 ,  B81B7/0038 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81B2207/99 ,  H04R1/04 ,  H04R1/2876 ,  H04R1/44 ,  H04R17/02 ,  H04R19/005 ,  H04R19/04 ,  H04R2201/003

摘要： Aspects of the disclosure provide a packaging technique for making a directional microphone which employs mechanical structures to cancel undesired background noise to realize the directional function instead of an extra sensor required in electronic noise-cancelling techniques, thus reducing footprint and cost of a directional microphone. A directional microphone based on this technique can include an acoustic sensor and a housing enclosing the acoustic sensor. The acoustic sensor can include a sensing diaphragm, a cavity below the sensing diaphragm, and a first substrate. The directional microphone device can further includes a channel with an inlet open at an edge of the first substrate and an outlet connected with the cavity. The housing can include a cover attached to a second substrate supporting the first substrate. The cover can include a first opening over the sensing diaphragm and a second opening at a side of the cover.

公开(公告)号：US10081536B2

公开(公告)日：2018-09-25

申请号：US15379401

申请日：2016-12-14

申请人： Texas Instruments Incorporated

发明人： Simon Joshua Jacobs ,  Molly Nelis Sing

IPC分类号： H01L29/12 ,  H01L29/84 ,  H01L23/10 ,  B81B7/00 ,  B81C1/00 ,  B81B7/02 ,  H01L23/20 ,  H01L21/56 ,  B29C65/48 ,  H01L21/67

CPC分类号： B81B7/0038 ,  B29C65/48 ,  B81B3/0016 ,  B81B7/02 ,  B81C1/00214 ,  H01L21/56 ,  H01L21/67 ,  H01L23/10 ,  H01L23/20 ,  H01L29/12 ,  H01L29/84

摘要： In described examples, a MEMS device is enclosed within a sealed package including nonmetal oxide gasses at levels greater than 1% by volume. In at least one example, the MEMS device is protected against premature failure from various causes, including charging, particle growth and stiction by moieties of the nonmetal oxide gasses reacting with various exposed surfaces within the package of the MEMS device and/or the adsorbed water layers on said surfaces.

公开(公告)号：US20180215610A1

公开(公告)日：2018-08-02

申请号：US15928008

申请日：2018-03-21

申请人： ULIS

发明人： Jérôme Favier ,  David Bunel

IPC分类号： B81B7/00 ,  G01J5/20 ,  H01L31/18 ,  H01L23/00 ,  B81C1/00

CPC分类号： B81B7/0038 ,  B81B2201/0207 ,  B81C1/00269 ,  B81C1/00285 ,  B81C2203/0145 ,  B81C2203/019 ,  G01J5/20 ,  H01L23/564 ,  H01L31/186 ,  H01L2224/48091 ,  H01L2924/00014

摘要： A device having a microelectronic component housed in a hermetically sealed housing having a vacuum inner space, and including a getter that substantially traps only hydrogen, is inert to oxygen and/or to nitrogen, and is housed in said inner space. Each of the constituent parts of the device being likely to degas into the inner space is a mineral material.

公开(公告)号：US10035699B2

公开(公告)日：2018-07-31

申请号：US15534477

申请日：2015-12-10

申请人： Robert Bosch GmbH

发明人： Ashwin K. Samarao ,  Gary O'Brien ,  Ando Feyh

IPC分类号： H01L23/31 ,  B81C1/00 ,  B81B7/00

CPC分类号： B81B7/0038 ,  B81B7/02 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81C1/00285

摘要： A method of fabricating a MEMS device includes depositing an expandable material into a first recess of a cap wafer. The cap wafer includes a plurality of walls that surround and define the first recess and a second recess. The cap wafer is bonded to a MEMS wafer including a first MEMS device and a second MEMS device. The first MEMS device is encapsulated in the first recess, and the second MEMS device is encapsulated in the second recess. The expandable material is then heated to at least an activation temperature to cause the expandable material to expand after the first recess has been sealed. The expansion of the expandable material causes a reduction in volume of the first recess.

公开(公告)号：US09980038B2

公开(公告)日：2018-05-22

申请号：US15606686

申请日：2017-05-26

申请人： Knowles Electronics, LLC

发明人： Anthony D. Minervini

IPC分类号： H04R1/28 ,  B81B7/00 ,  H04R19/00 ,  H04R19/01 ,  H04R19/04 ,  H04R31/00 ,  B81C1/00 ,  H01L23/10 ,  H01L23/15 ,  H04R1/04 ,  H04R3/00 ,  B81C3/00 ,  B81B3/00 ,  H01L21/78 ,  H04R1/22 ,  H04R23/00

CPC分类号： H04R1/2892 ,  B81B3/0021 ,  B81B7/0038 ,  B81B7/0058 ,  B81B7/0061 ,  B81B7/0064 ,  B81B7/007 ,  B81B2201/0257 ,  B81B2207/092 ,  B81C1/00158 ,  B81C1/00301 ,  B81C3/00 ,  H01L21/78 ,  H01L23/10 ,  H01L23/15 ,  H01L2924/0002 ,  H01L2924/1461 ,  H04R1/04 ,  H04R1/222 ,  H04R3/00 ,  H04R19/005 ,  H04R19/016 ,  H04R19/04 ,  H04R23/00 ,  H04R31/006 ,  H04R2201/003 ,  H04R2225/49 ,  H04R2410/03 ,  Y10T29/49005 ,  Y10T29/4908 ,  Y10T29/49798 ,  H01L2924/00

摘要： A surface mount package for a micro-electro-mechanical system (MEMS) microphone die is disclosed. The surface mount package features a substrate with metal pads for surface mounting the package to a device's printed circuit board and for making electrical connections between the microphone package and the device's circuit board. The surface mount microphone package has a cover, and the MEMS microphone die is substrate-mounted and acoustically coupled to an acoustic port provided in the surface mount package. The substrate and the cover are joined together to form the MEMS microphone, and the substrate and cover cooperate to form an acoustic chamber for the substrate-mounted MEMS microphone die.

公开(公告)号：US09890036B2

公开(公告)日：2018-02-13

申请号：US15429636

申请日：2017-02-10

申请人： TEXAS INSTRUMENTS INCORPORATED

发明人： John Charles Ehmke ,  Virgil Cotoco Ararao

IPC分类号： H01L21/00 ,  H01L21/31 ,  H01L21/469 ,  B81B7/00 ,  B81C1/00 ,  G02B26/08 ,  G02B6/42 ,  G02B26/00 ,  B82Y30/00

CPC分类号： B81B7/0038 ,  B81B2203/0315 ,  B81C1/00269 ,  B81C1/00285 ,  B81C1/00293 ,  B81C2201/0108 ,  B81C2201/013 ,  B81C2201/0188 ,  B81C2201/0198 ,  B81C2201/053 ,  B81C2203/0109 ,  B81C2203/0118 ,  B81C2203/019 ,  B81C2203/035 ,  B82Y30/00 ,  G02B6/4204 ,  G02B6/4208 ,  G02B6/4248 ,  G02B26/001 ,  G02B26/0833 ,  H01L24/03 ,  H01L24/05 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L24/94 ,  H01L2224/03612 ,  H01L2224/03614 ,  H01L2224/039 ,  H01L2224/04026 ,  H01L2224/05083 ,  H01L2224/05109 ,  H01L2224/05123 ,  H01L2224/05138 ,  H01L2224/05163 ,  H01L2224/05166 ,  H01L2224/0517 ,  H01L2224/05562 ,  H01L2224/27462 ,  H01L2224/2747 ,  H01L2224/279 ,  H01L2224/29006 ,  H01L2224/29011 ,  H01L2224/29023 ,  H01L2224/29109 ,  H01L2224/29144 ,  H01L2224/32058 ,  H01L2224/32227 ,  H01L2224/83121 ,  H01L2224/83193 ,  H01L2224/8381 ,  H01L2224/83825 ,  H01L2224/94 ,  H01L2924/0002 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01074 ,  H01L2924/1461 ,  H01L2924/164 ,  H01L2924/00014 ,  H01L2924/01049 ,  H01L2224/03 ,  H01L2924/01042 ,  H01L2924/01072 ,  H01L2924/01004 ,  H01L2224/83 ,  H01L2224/0345 ,  H01L2224/0361 ,  H01L2224/03462

摘要： In described examples, a hermetic package of a microelectromechanical system (MEMS) structure includes a substrate having a surface with a MEMS structure of a first height. The substrate is hermetically sealed to a cap forming a cavity over the MEMS structure. The cap is attached to the substrate surface by a vertical stack of metal layers adhering to the substrate surface and to the cap. The stack has a continuous outline surrounding the MEMS structure while spaced from the MEMS structure by a distance. The stack has: a first bottom metal seed film adhering to the substrate and a second bottom metal seed film adhering to the first bottom metal seed film; and a first top metal seed film adhering to the cap and a second top metal seed film adhering to the first top metal seed film.

公开(公告)号：US09884758B2

公开(公告)日：2018-02-06

申请号：US15182754

申请日：2016-06-15

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Shyh-Wei Cheng ,  Hsi-Cheng Hsu ,  Hsin-Yu Chen ,  Ji-Hong Chiang ,  Jui-Chun Weng ,  Wei-Ding Wu ,  Yu-Jui Wu ,  Ching-Hsiang Hu ,  Ming-Tsung Chen

IPC分类号： H01L21/00 ,  B81C1/00 ,  B81B7/00

CPC分类号： B81C1/00285 ,  B81B7/0038 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2207/012 ,  B81B2207/07 ,  B81C2203/0118 ,  B81C2203/0792

摘要： The present disclosure relates to a MEMS package having an outgassing element configured to adjust a pressure within a hermetically sealed cavity by inducing outgassing of into the cavity, and an associated method. In some embodiments, the method is performed by forming an outgassing element within a passivation layer over a CMOS substrate and forming an outgassing resistive layer to cover the outgassing element. The outgassing resistive layer is removed from over the outgassing element, and the MEMS substrate is bonded to a front side of the CMOS substrate to enclose a first MEMS device within a first cavity and a second MEMS device within a second cavity. After removing the outgassing resistive layer, the outgassing element releases a gas into the second cavity to increase a second pressure of the second cavity to be greater than a first pressure of the first cavity.