利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

4 条记录 (耗时 0.014 秒)

    POWER SEMICONDUCTOR MODULE HAVING A HALF-BRIDGE CONFIGURATION
    1.
    发明申请
    POWER SEMICONDUCTOR MODULE HAVING A HALF-BRIDGE CONFIGURATION 有权
    具有半桥配置的功率半导体模块

    公开(公告)号：US20070177358A1

    公开(公告)日：2007-08-02

    申请号：US11555764

    申请日：2006-11-02

    申请人： Oliver Schilling ,  Martin Woelz

    发明人： Oliver Schilling ,  Martin Woelz

    IPC分类号： H05K5/00

    CPC分类号： H01L25/072 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/30107 ,  H02M7/003 ,  H01L2924/00

    摘要： A power semiconductor module having a carrier plate, on which at least four substrates are arranged, and having a first and a second busbar having two conductive plates is disclosed. The conductive plates are arranged such that they are at a distance from one another and are insulated from one another, for respectively carrying a lower and an upper electrical potential, said busbars each being fitted with outer connecting lugs which lead away from the substrates and inner connecting lugs on the substrate side. Symmetrization of the current during dynamic commutation operations is achieved by correctly selecting the order of the outer connecting lugs of the respective first busbar for a lower potential and of the second busbar for an upper potential in accordance with the order of the inner connecting points of the parallel-connected half-bridge circuits and also of the inner connecting lugs of the first busbar and of the second busbar.

    摘要翻译： 公开了一种具有承载板的功率半导体模块，其上布置有至少四个基板，并且具有具有两个导电板的第一和第二母线。 导电板被布置成使得它们彼此间隔开并且彼此绝缘，用于分别承载下部和上部电位，所述母线各自装配有从基板和内部引出的外部连接凸耳 在基板侧连接凸耳。 在动态换向操作期间对电流的对称是通过根据第一母线的内部连接点的顺序正确地选择用于较低电位的相应第一母线的外部连接凸耳的顺序和用于上部电位的第二母线的顺序 并联连接的半桥电路以及第一母线和第二母线的内部连接凸耳。

    Power semiconductor module having a half-bridge configuration
    2.
    发明授权
    Power semiconductor module having a half-bridge configuration 有权
    具有半桥配置的功率半导体模块

    公开(公告)号：US07352587B2

    公开(公告)日：2008-04-01

    申请号：US11555764

    申请日：2006-11-02

    申请人： Oliver Schilling ,  Martin Woelz

    发明人： Oliver Schilling ,  Martin Woelz

    IPC分类号： H05K7/02

    CPC分类号： H01L25/072 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/30107 ,  H02M7/003 ,  H01L2924/00

    摘要： A power semiconductor module having a carrier plate, on which at least four substrates are arranged, and having a first and a second busbar having two conductive plates is disclosed. The conductive plates are arranged such that they are at a distance from one another and are insulated from one another, for respectively carrying a lower and an upper electrical potential, said busbars each being fitted with outer connecting lugs which lead away from the substrates and inner connecting lugs on the substrate side. Symmetrization of the current during dynamic commutation operations is achieved by correctly selecting the order of the outer connecting lugs of the respective first busbar for a lower potential and of the second busbar for an upper potential in accordance with the order of the inner connecting points of the parallel-connected half-bridge circuits and also of the inner connecting lugs of the first busbar and of the second busbar.

    摘要翻译： 公开了一种具有承载板的功率半导体模块，其上布置有至少四个基板，并且具有具有两个导电板的第一和第二母线。 导电板被布置成使得它们彼此间隔开并且彼此绝缘，用于分别承载下部和上部电位，所述母线各自装配有从基板和内部引出的外部连接凸耳 在基板侧连接凸耳。 在动态换向操作期间对电流的对称是通过根据第一母线的内部连接点的顺序正确地选择用于较低电位的相应第一母线的外部连接凸耳的顺序和用于上部电位的第二母线的顺序 并联连接的半桥电路以及第一母线和第二母线的内部连接凸耳。