公开(公告)号：US11063083B2

公开(公告)日：2021-07-13

申请号：US16600180

申请日：2019-10-11

Applicant: OmniVision Technologies, Inc.

Inventor： Teng-Sheng Chen ,  Wei-Ping Chen ,  Ying Chung ,  Chen-Yu Hung

IPC: H01L31/0232 ,  H01L27/146

Abstract: A method for manufacturing light-shielded cameras includes forming a plurality of camera dies by dicing a camera wafer stack including (a) an image sensor wafer having a plurality of image sensors, (b) a cover glass bonded to the image sensor wafer, and (c) a lens wafer bonded to the cover glass and having a plurality of lenses, to form a plurality of camera dies. The method further includes, prior to the step of dicing, (i) from a first side of the image sensor wafer facing away from the cover glass and at least partly covered by an opaque layer, pre-cutting a sensor-cover wafer stack that includes the image sensor wafer and the cover glass, and (ii) depositing an opaque material in the pre-cuts. The method also includes, after the step of dicing, applying an opaque coating to second-side surfaces, of the camera dies, formed by the step of dicing.