公开(公告)号：US20210193716A1

公开(公告)日：2021-06-24

申请号：US16725698

申请日：2019-12-23

Applicant: OMNIVISION TECHNOLOGIES, INC.

Inventor： Wei-Feng Lin ,  Ying-Chih Kuo ,  Ying Chung

IPC: H01L27/146

Abstract: An image sensor package includes a transparent substrate with a recess formed in the transparent substrate, and an image sensor positioned in the recess so that light incident on the transparent substrate passes through the transparent substrate to the image sensor. The image sensor package also includes a circuit board electrically disposed in the recess and coupled to receive image data from the image sensor, and the image sensor is positioned in the recess between the circuit board and the transparent substrate.

公开(公告)号：US11626434B2

公开(公告)日：2023-04-11

申请号：US17530358

申请日：2021-11-18

Applicant: OMNIVISION TECHNOLOGIES, INC.

Inventor： Wei-Feng Lin ,  Ying-Chih Kuo ,  Ying Chung

IPC: H01L27/146

Abstract: A method of image sensor package fabrication includes forming a recess in a transparent substrate, depositing conductive traces in the recess, inserting an image sensor in the recess so that the image sensor is positioned in the recess to receive light through the transparent substrate, and inserting a circuit board in the recess so that the image sensor is positioned between the transparent substrate and the circuit board.

公开(公告)号：US11211414B2

公开(公告)日：2021-12-28

申请号：US16725698

申请日：2019-12-23

Applicant: OMNIVISION TECHNOLOGIES, INC.

Inventor： Wei-Feng Lin ,  Ying-Chih Kuo ,  Ying Chung

IPC: H01L27/146

Abstract: An image sensor package includes a transparent substrate with a recess formed in the transparent substrate, and an image sensor positioned in the recess so that light incident on the transparent substrate passes through the transparent substrate to the image sensor. The image sensor package also includes a circuit board electrically disposed in the recess and coupled to receive image data from the image sensor, and the image sensor is positioned in the recess between the circuit board and the transparent substrate.

公开(公告)号：US11063083B2

公开(公告)日：2021-07-13

申请号：US16600180

申请日：2019-10-11

Applicant: OmniVision Technologies, Inc.

Inventor： Teng-Sheng Chen ,  Wei-Ping Chen ,  Ying Chung ,  Chen-Yu Hung

IPC: H01L31/0232 ,  H01L27/146

Abstract: A method for manufacturing light-shielded cameras includes forming a plurality of camera dies by dicing a camera wafer stack including (a) an image sensor wafer having a plurality of image sensors, (b) a cover glass bonded to the image sensor wafer, and (c) a lens wafer bonded to the cover glass and having a plurality of lenses, to form a plurality of camera dies. The method further includes, prior to the step of dicing, (i) from a first side of the image sensor wafer facing away from the cover glass and at least partly covered by an opaque layer, pre-cutting a sensor-cover wafer stack that includes the image sensor wafer and the cover glass, and (ii) depositing an opaque material in the pre-cuts. The method also includes, after the step of dicing, applying an opaque coating to second-side surfaces, of the camera dies, formed by the step of dicing.

公开(公告)号：US10199333B2

公开(公告)日：2019-02-05

申请号：US15642132

申请日：2017-07-05

Applicant: OmniVision Technologies, Inc.

Inventor： Ying-Chih Kuo ,  Ying Chung

IPC: H01L23/00 ,  H01L27/146

Abstract: A delamination-resistant semiconductor device includes a conductive layer, a semiconductor layer, and a spacer. The conductive layer has a first side opposite a second side. The semiconductor layer is on the first side and defines an aperture therethrough spanned by the conductive layer. The spacer is on the second side and has a top surface, proximate the conductive layer, that defines a blind hole spanned by the conductive layer. A method for preventing delamination of a multilayer structure, includes a step of disposing a first layer on a substrate such that the first layer spans an aperture of the substrate. The method also includes a step of disposing a second layer on the first layer. The second layer has a blind hole adjacent to the first layer such that the first layer spans the blind hole.

公开(公告)号：US20220077210A1

公开(公告)日：2022-03-10

申请号：US17530358

申请日：2021-11-18

Applicant: OMNIVISION TECHNOLOGIES, INC.

Inventor： Wei-Feng Lin ,  Ying-Chih Kuo ,  Ying Chung

IPC: H01L27/146

Abstract: A method of image sensor package fabrication includes forming a recess in a transparent substrate, depositing conductive traces in the recess, inserting an image sensor in the recess so that the image sensor is positioned in the recess to receive light through the transparent substrate, and inserting a circuit board in the recess so that the image sensor is positioned between the transparent substrate and the circuit board.

公开(公告)号：US20180082937A1

公开(公告)日：2018-03-22

申请号：US15268169

申请日：2016-09-16

Applicant: OmniVision Technologies, Inc.

Inventor： Chi-Kuei Lee ,  Ying Chung ,  Ying-Chih Kuo ,  Wei-Feng Lin

IPC: H01L23/498 ,  H01L21/56 ,  H01L23/00 ,  H01L21/02 ,  H01L23/31

CPC classification number: H01L23/49838 ,  H01L21/02274 ,  H01L23/3171 ,  H01L24/03 ,  H01L24/06 ,  H01L2224/0401

Abstract: A microchip includes a passivation layer formed over underlying circuitry, a redistribution layer formed over the passivation layer, and a cap layer formed over the redistribution conductors of the redistribution layer and in contact with the passivation layer. The passivation layer and the cap layer have one or more compatibilities that provide sufficient adhesion between those two layers to prevent metal migration from the conductors of the redistribution layer between the interfaces of the passivation and cap layers. In one embodiment, the passivation and cap layers are each formed from an inorganic oxide (e.g., SiO2) using a process (e.g., PECVD) that provides substantially-uniform step coverage by the cap layer in trench and via regions of underlying circuitry. The invention increases the reliability of the microchip, because it eliminates metal migration, and the electrical shorting caused therefrom, in the redistribution layer.

公开(公告)号：US09922922B1

公开(公告)日：2018-03-20

申请号：US15268169

申请日：2016-09-16

Applicant: OmniVision Technologies, Inc.

Inventor： Chi-Kuei Lee ,  Ying Chung ,  Ying-Chih Kuo ,  Wei-Feng Lin

IPC: H01L23/498 ,  H01L21/56 ,  H01L23/00 ,  H01L21/02 ,  H01L23/31

CPC classification number: H01L23/49838 ,  H01L21/02274 ,  H01L23/3171 ,  H01L24/03 ,  H01L24/06 ,  H01L2224/0401

Abstract: A microchip includes a passivation layer formed over underlying circuitry, a redistribution layer formed over the passivation layer, and a cap layer formed over the redistribution conductors of the redistribution layer and in contact with the passivation layer. The passivation layer and the cap layer have one or more compatibilities that provide sufficient adhesion between those two layers to prevent metal migration from the conductors of the redistribution layer between the interfaces of the passivation and cap layers. In one embodiment, the passivation and cap layers are each formed from an inorganic oxide (e.g., SiO2) using a process (e.g., PECVD) that provides substantially-uniform step coverage by the cap layer in trench and via regions of underlying circuitry. The invention increases the reliability of the microchip, because it eliminates metal migration, and the electrical shorting caused therefrom, in the redistribution layer.