公开(公告)号：US20150115129A1

公开(公告)日：2015-04-30

申请号：US14513705

申请日：2014-10-14

Applicant: OmniVision Technologies, Inc.

Inventor： George Barnes ,  Donald Combs ,  Michael Rickers ,  Elizabeth Zachary

IPC: H01L27/146

CPC classification number: B29C33/56 ,  B29C33/38 ,  B29D11/00307 ,  B29D11/0048

Abstract: A coated diamond-turned replication master for manufacturing wafer level lens arrays includes a low-hardness diamond-turnable sheet, a mold surface formed in the low-hardness diamond-turnable sheet, and an oxidation-resistant coating formed on the mold surface for protecting same. The mold surface includes a plurality of optical forms, all of which cut therein by a single diamond cutting tool. A process for forming a coated diamond-turned replication master includes a step of forming a mold surface in a low-hardness diamond-turnable sheet using a single diamond cutting tool. The mold surface includes a plurality of optical forms, all of which are formed by the single diamond cutting tool. The process also includes, after the step of forming a plurality of optical forms, coating the mold surface with an oxidation-resistant coating.

Abstract translation: 用于制造晶片级透镜阵列的经涂覆的金刚石复制主体包括低硬度金刚石可转动片，在低硬度金刚石可转动片中形成的模具表面，以及形成在模具表面上用于保护的抗氧化涂层 相同。 模具表面包括多个光学形式，所有这些光学形式都通过单个金刚石切割工具在其中切割。 用于形成涂覆金刚石复制主体的方法包括使用单个金刚石切割工具在低硬度金刚石可转动片材中形成模具表面的步骤。 模具表面包括多个光学形式，它们都由单个金刚石切割工具形成。 该方法还包括在形成多个光学形式的步骤之后，用抗氧化涂层涂覆模具表面。

公开(公告)号：US10359609B2

公开(公告)日：2019-07-23

申请号：US15445400

申请日：2017-02-28

Applicant: OmniVision Technologies, Inc.

Inventor： George Barnes ,  Goran Rauker

IPC: G02B13/00 ,  G03F7/09 ,  G03F7/20 ,  G03F7/40 ,  G03F7/30 ,  G03F7/38 ,  G03F7/16 ,  G03F7/004 ,  G02B3/00 ,  G03F7/00 ,  G03F7/11 ,  G03F7/038 ,  G03F7/095 ,  G02B7/00

Abstract: A spacer wafer for a wafer-level camera, a wafer-level camera including the spacer wafer and a method of manufacturing a spacer wafer include a layer of photoresist being formed over a substrate, the layer of photoresist being exposed to radiation through a mask that defines a spacer geometry for at least one wafer-level camera element. The layer photoresist is developed, such that the layer of photoresist is the spacer wafer for the wafer-level camera.

公开(公告)号：US20170168270A1

公开(公告)日：2017-06-15

申请号：US15445400

申请日：2017-02-28

Applicant: OmniVision Technologies, Inc.

Inventor： George Barnes ,  Goran Rauker

IPC: G02B13/00 ,  G02B3/00 ,  G03F7/038 ,  G03F7/00 ,  G03F7/20 ,  G03F7/38 ,  G03F7/30 ,  G02B7/00 ,  G03F7/16

CPC classification number: G02B13/0085 ,  G02B3/0031 ,  G02B3/0056 ,  G02B3/0068 ,  G02B3/0075 ,  G02B7/003 ,  G03F7/00 ,  G03F7/0005 ,  G03F7/0045 ,  G03F7/038 ,  G03F7/092 ,  G03F7/0957 ,  G03F7/11 ,  G03F7/162 ,  G03F7/168 ,  G03F7/20 ,  G03F7/30 ,  G03F7/38 ,  Y10T428/24273 ,  Y10T428/24942 ,  Y10T428/265 ,  Y10T428/31504 ,  Y10T428/31511

Abstract: A spacer wafer for a wafer-level camera, a wafer-level camera including the spacer wafer and a method of manufacturing a spacer wafer include a layer of photoresist being formed over a substrate, the layer of photoresist being exposed to radiation through a mask that defines a spacer geometry for at least one wafer-level camera element. The layer photoresist is developed, such that the layer of photoresist is the spacer wafer for the wafer-level camera.