公开(公告)号：US08722314B2

公开(公告)日：2014-05-13

申请号：US13117927

申请日：2011-05-27

申请人： Tadashi Kuriki

发明人： Tadashi Kuriki

IPC分类号： G03F7/00

CPC分类号： H05K3/064 ,  G03F7/06 ,  G03F7/091 ,  G03F7/0957 ,  G03F7/105 ,  G03F7/2032 ,  H05K2201/0108 ,  H05K2203/1572

摘要： A first exposure treatment for irradiating a first photosensitive layer formed on one main surface of a transparent support with a first light thereby to expose the first photosensitive layer and a second exposure treatment for irradiating a second photosensitive layer formed on the other main surface of the transparent support with a second light to expose the second photosensitive layer are performed such that the first light incident on the first photosensitive layer does not substantially reach the second photosensitive layer and the second light incident on the second photosensitive layer does not substantially reach the first photosensitive layer.

摘要翻译： 第一曝光处理，用于用第一光照射形成在透明支撑体的一个主表面上的第一感光层，从而露出第一感光层，以及第二曝光处理，用于照射形成在透明的另一个主表面上的第二感光层 执行第二光以暴露第二感光层的支撑，使得入射在第一感光层上的第一光基本上不到达第二感光层，并且入射到第二感光层上的第二光基本上不到达第一感光层 。

公开(公告)号：US20130122247A1

公开(公告)日：2013-05-16

申请号：US13293937

申请日：2011-11-10

申请人： George Barnes ,  Goran Rauker

发明人： George Barnes ,  Goran Rauker

IPC分类号： B32B3/10 ,  B32B7/02 ,  B32B27/38 ,  B32B3/00 ,  G03F7/20 ,  B32B9/04

CPC分类号： G02B13/0085 ,  G02B3/0031 ,  G02B3/0056 ,  G02B3/0068 ,  G02B3/0075 ,  G02B7/003 ,  G03F7/00 ,  G03F7/0005 ,  G03F7/0045 ,  G03F7/038 ,  G03F7/092 ,  G03F7/0957 ,  G03F7/11 ,  G03F7/162 ,  G03F7/168 ,  G03F7/20 ,  G03F7/30 ,  G03F7/38 ,  Y10T428/24273 ,  Y10T428/24942 ,  Y10T428/265 ,  Y10T428/31504 ,  Y10T428/31511

摘要： A spacer wafer for a wafer-level camera, a wafer-level camera including the spacer wafer and a method of manufacturing a spacer wafer include a layer of photoresist being formed over a substrate, the layer of photoresist being exposed to radiation through a mask that defines a spacer geometry for at least one wafer-level camera element. The layer photoresist is developed, such that the layer of photoresist is the spacer wafer for the wafer-level camera.

摘要翻译： 用于晶片级相机的间隔晶片，包括间隔晶片的晶片级相机和制造间隔晶片的方法包括在基板上形成的光致抗蚀剂层，该光致抗蚀剂层通过掩模暴露于辐射，该掩模 限定用于至少一个晶片级相机元件的间隔件几何形状。 显影层光致抗蚀剂，使得光致抗蚀剂层是用于晶片级相机的间隔晶片。

公开(公告)号：US07767273B2

公开(公告)日：2010-08-03

申请号：US11370136

申请日：2006-03-06

申请人： John S. Huizinga ,  Vincent W. S. King ,  John T. Strand ,  James N. Dobbs ,  Thomas B. Hunter ,  Samual W. Hunter, legal representative ,  Thelma E. Hunter, legal representative ,  William V. Dower ,  Daniel H. Carlson ,  Serge Wetzels ,  Gregory F. King ,  Olester Benson, Jr. ,  Brian W. Lueck ,  Haiyan Zhang ,  Jeremy K. Larsen ,  M. Benton Free ,  David W. Kuhns

发明人： John S. Huizinga ,  Vincent W. S. King ,  John T. Strand ,  James N. Dobbs ,  Thomas B. Hunter ,  William V. Dower ,  Daniel H. Carlson ,  Serge Wetzels ,  Gregory F. King ,  Olester Benson, Jr. ,  Brian W. Lueck ,  Haiyan Zhang ,  Jeremy K. Larsen ,  M. Benton Free ,  David W. Kuhns

IPC分类号： B05D5/06

CPC分类号： B29C59/04 ,  B05D1/40 ,  B05D3/067 ,  B05D3/12 ,  B05D2252/02 ,  B29C35/0805 ,  B29C35/0888 ,  B29C35/0894 ,  B29C39/148 ,  B29C39/203 ,  B29C59/046 ,  B29C2035/0827 ,  B29C2043/463 ,  B29C2059/023 ,  G03F7/0957 ,  G03F7/2032 ,  H05K1/0393 ,  H05K3/0008 ,  H05K3/0079 ,  H05K3/101 ,  H05K2201/0108 ,  H05K2203/0113 ,  H05K2203/0143 ,  H05K2203/1545 ,  H05K2203/1572

摘要： An apparatus for casting a patterned surface on both sides of an opaque web. The apparatus includes a first patterned roll, a second pattered roll, and a means for rotating the first and second patterned rolls such that their patterns are transferred to opposite sides of the opaque web while it is in continuous motion. During this process, their patterns are maintained in continuous registration to within at least 100 micrometers.

摘要翻译： 用于在不透明网的两侧上铸造图案化表面的装置。 该设备包括第一图案化辊，第二图案辊和用于旋转第一和第二图案化辊的装置，使得它们的图案在连续运动时转移到不透明纸幅的相对侧。 在该过程中，它们的图案被保持在至少100微米内的连续配准。

公开(公告)号：US20020001978A1

公开(公告)日：2002-01-03

申请号：US09863833

申请日：2001-05-23

发明人： Christian Fleitz

IPC分类号： H01L021/00

CPC分类号： G03F7/0957 ,  G03F7/38 ,  G03F7/40 ,  H01L21/0274

摘要： A method for developing a pattern, on a photosensitive material of negative type, including the steps of depositing the photosensitive material on a surface of a semiconductor substrate; drying the material to obtain the adherence of the material while maintaining some flexibility to it; exposing, according to a desired pattern, regions of the photosensitive material; and annealing to solidify the photosensitive material.

摘要翻译： 一种在负型感光材料上形成图案的方法，包括以下步骤：将感光材料沉积在半导体衬底的表面上; 干燥材料以获得材料的粘附，同时保持一定的柔韧性; 根据期望的图案曝光感光材料的区域; 和退火以固化感光材料。

公开(公告)号：US5858581A

公开(公告)日：1999-01-12

申请号：US990891

申请日：1997-12-15

申请人： Stanley W. Stephenson

发明人： Stanley W. Stephenson

IPC分类号： G02F1/1333 ,  G02F1/135 ,  G03F7/00 ,  G03F7/095 ,  G03F7/20 ,  G03C5/30 ,  G02F1/1335 ,  G02F1/1343 ,  G03C5/26

CPC分类号： G03F7/2022 ,  G03F7/0007 ,  G03F7/0957

摘要： A method of fabricating a display having light sensitive conductive traces, including providing first and second light sensitive layers respectively over both sides of an electrically sensitive light modulating layer, the first and second light sensitive layers being conductive and patternable; patterning the first light sensitive layer to a first wavelength of radiation to form first conductive traces; and patterning the second light sensitive layer to a second wavelength of radiation to form second conductive traces.

摘要翻译： 一种制造具有光敏导电迹线的显示器的方法，包括分别在电敏感光调制层的两侧提供第一和第二光敏层，第一和第二光敏层是导电和可图案化的; 将第一光敏层图案化成第一波长的辐射以形成第一导电迹线; 以及将所述第二光敏层图案化成第二波长的辐射以形成第二导电迹线。

公开(公告)号：US20230251580A1

公开(公告)日：2023-08-10

申请号：US18008739

申请日：2020-07-06

申请人： EV Group E. Thallner GmbH

发明人： Bernhard Thallner ,  Boris Povazay ,  Tobias Zenger ,  Thomas Uhrmann

IPC分类号： G03F7/20 ,  G03F7/095

CPC分类号： G03F7/70466 ,  G03F7/0957

摘要： The invention relates to a method and a device for the exposure of a photosensitive coating.

公开(公告)号：US20190027686A1

公开(公告)日：2019-01-24

申请号：US15864472

申请日：2018-01-08

申请人： SAMSUNG DISPLAY CO., LTD.

发明人： Youngdae KIM ,  Sangjin PARK ,  Minjae JEONG

IPC分类号： H01L51/00 ,  H01L51/56 ,  G03F7/039 ,  G03F7/038 ,  G03F7/213 ,  G03F7/26 ,  G03F7/09 ,  G03F7/095 ,  G03F7/20

CPC分类号： H01L51/0011 ,  C23C14/042 ,  G03F7/038 ,  G03F7/039 ,  G03F7/094 ,  G03F7/095 ,  G03F7/0957 ,  G03F7/12 ,  G03F7/2022 ,  G03F7/213 ,  G03F7/26 ,  H01L51/56

摘要： A method of manufacturing a mask includes attaching a first mask base substrate and a second mask base substrate to opposite sides of an adhesive layer, forming a photoresist layer on the first and second mask base substrates, exposing and developing the photoresist layer to remove the photoresist layer on effective area at centers of surfaces of the first and second mask base substrates such that the first photoresist layer remains on non-effective areas at edges of surfaces of the first mask base substrate and the second mask base substrate, etching the effective area to form a stepped groove on the first and second mask base substrates, separating the first and second mask base substrates from the adhesive layer, and forming a pattern hole in the effective area of first and second mask base substrates, each with the first stepped groove thereon.

公开(公告)号：US20180202035A1

公开(公告)日：2018-07-19

申请号：US15743944

申请日：2016-08-04

申请人： AP SYSTEMS INC.

发明人： Jong-Kab Park ,  Bo-Ram Kim ,  Jun-Gyu Hur ,  Doh-Hoon KIM

IPC分类号： C23C14/04 ,  B23K26/352

CPC分类号： C23C14/042 ,  B23K26/352 ,  G03F7/0957 ,  G03F7/12 ,  H01L21/027 ,  H01L21/0338 ,  H01L21/31 ,  H01L51/0011 ,  Y10S148/143

摘要： The present invention discloses a method of manufacturing a shadow mask, wherein hybrid processing is used to form a mask pattern on the shadow mask, the method includes: forming a wet-etched pattern by performing wet etching from above a base; and forming a laser-processed pattern that continues from the wet-etched pattern, by performing laser processing from above the base or from below the base on which the wet-etched pattern is formed. The present invention uses hybrid processing including wet etching and laser processing for manufacturing a shadow mask. The method has an effect on solving the productivity degradation of the conventional laser processing and provides a shadow mask with high quality using wet etching.

公开(公告)号：US20170363953A1

公开(公告)日：2017-12-21

申请号：US15523692

申请日：2015-11-03

申请人： Universität Osnabrück

发明人： Martin STEINHART ,  Longjian XUE

IPC分类号： G03F7/00 ,  B82Y40/00 ,  B82Y10/00 ,  C23F1/08 ,  G03F7/095

CPC分类号： G03F7/0002 ,  B82Y10/00 ,  B82Y40/00 ,  C23F1/08 ,  G03F7/0957

摘要： The present invention relates to a device for carrying out a capillary nanoprinting method, comprising at least one monolithic combination of a substrate (1) and one or more contact elements (2), at least parts of said contact elements (2) having a porous structure, preferably also at least parts of the substrate having a porous structure, particularly the entire monolithic combination having a porous structure.

公开(公告)号：US5334487A

公开(公告)日：1994-08-02

申请号：US918989

申请日：1992-07-23

申请人： Thomas E. Kindl ,  Ronald J. Moore ,  Paul G. Rickerl

发明人： Thomas E. Kindl ,  Ronald J. Moore ,  Paul G. Rickerl

IPC分类号： G03F7/095 ,  G03F7/20 ,  H05K1/00 ,  H05K1/11 ,  H05K3/00 ,  H05K3/06 ,  H05K3/34 ,  G03F7/00

CPC分类号： H05K1/112 ,  G03F7/0957 ,  G03F7/2022 ,  H05K3/0023 ,  H05K1/0393 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2201/09472 ,  H05K2203/041 ,  H05K3/064 ,  H05K3/3478

摘要： The present invention provides a method of forming a pattern of conductive material on dielectric material with access openings or vias through said dielectric material and such a structure. A sheet of conductive material, which is to be circuitized, is provided with a layer of a first photoimageable dielectric material on one face thereof. A layer of a second photoimageable material, such as a conventional photoresist material, is provided on the opposite face of the conductive material. The layer of said first photoimageable material is selected such that it will not be developed by the developer that develops the layer of said second material. The two layers of photoimageable material are pattern-wise exposed to radiation. The second layer of material is developed and the revealed underlying conductive material is etched to form the desired circuit pattern. The first layer is then developed to form openings or vias communicating with the circuit pattern, and these are then filled with a conductive material such as solder.

摘要翻译： 本发明提供了一种在电介质材料上形成具有通过所述介电材料和这种结构的进入开口或通孔的导电材料图案的方法。 要电路化的导电材料片在其一个表面上设置有第一可光成像电介质材料层。 在导电材料的相对面上设置有诸如常规光致抗蚀剂材料的第二可光成象材料层。 选择所述第一可光成像材料的层，使得其不会由显影剂显影出所述第二材料的层。 两层可光成像材料以图案方式暴露于辐射。 显影第二层材料，并将所揭示的底层导电材料进行蚀刻以形成所需的电路图案。 然后显影第一层以形成与电路图案连通的开口或通孔，然后用诸如焊料的导电材料填充第一层。