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公开(公告)号：US20240241347A1
公开(公告)日：2024-07-18
申请号：US18098649
申请日：2023-01-18
Applicant: OmniVision Technologies, Inc.
Inventor： I-Lung LU , Jau-Jan DENG , Kuang-Ju WANG
CPC classification number: G02B13/004 , G02B9/34
Abstract: A compound lens includes four coaxially aligned lenses: first lens and, in order of increasing distance therefrom and on a same side thereof, a second lens, a third lens, and a fourth lens. The first lens and the third lens are negative lenses. The second lens and the fourth lens are positive lenses. An image-side surface of the second lens and an object-side surface of the third lens have respective radii of curvature of equal magnitude.
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公开(公告)号：US20200218043A1
公开(公告)日：2020-07-09
申请号：US16243935
申请日：2019-01-09
Applicant: OmniVision Technologies, Inc.
Inventor： Tingyu CHENG , Jau-Jan DENG
IPC: G02B15/177 , G02B15/20 , G02B23/24
Abstract: A bimodal zoom lens includes three coaxially aligned lenses including a first lens, a third lens, and a second lens therebetween. The first lens is a negative lens, each of the second lens and the third lens is a positive lens. The three coaxially aligned lenses form (i) a first configuration when the second lens and the first lens are separated by an axial distance L11 and (ii) a second configuration when the second lens and the first lens are separated by an axial distance L12, which exceeds axial distance L11. The second configuration has a second effective focal length that exceeds a first effective focal length of the first configuration.
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公开(公告)号：US20160004049A1
公开(公告)日：2016-01-07
申请号：US14323846
申请日：2014-07-03
Applicant: OmniVision Technologies, Inc.
Inventor： Chuen-Yi YIN , Jau-Jan DENG
CPC classification number: G02B13/0085 , B29D11/00307 , G02B9/12 , G02B13/0035 , G02B13/006
Abstract: A wafer-level lens system includes one or more wafer-level lenses, each of the one or more wafer-level lenses having a substrate with opposing first and second surfaces, a first lens element of a first material and disposed on the first surface, and a second lens element of a second material and disposed on the second surface, wherein, for at least one of the one or more wafer-level lenses, the first material is different from the second material. Another wafer-level lens system includes three wafer-level lenses optically coupled in series with each other, each of the three wafer-level lenses having a substrate with opposing first and second surfaces, a first lens element disposed on the first surface and having an aspheric surface facing away from the first surface, and a second lens element disposed on the second surface and having an aspheric surface facing away from the second surface.
Abstract translation: 晶片级透镜系统包括一个或多个晶片级透镜，所述一个或多个晶片级透镜中的每一个具有具有相对的第一和第二表面的基板，第一材料的第一透镜元件并且设置在第一表面上， 以及第二材料的第二透镜元件，并且设置在所述第二表面上，其中，对于所述一个或多个晶片级透镜中的至少一个，所述第一材料与所述第二材料不同。 另一个晶片级透镜系统包括三个晶片级透镜，它们彼此串联耦合，三个晶片级透镜中的每个透镜具有相对的第一和第二表面的基板，设置在第一表面上的第一透镜元件， 面对第一表面的非球面表面和设置在第二表面上并且具有背离第二表面的非球面的第二透镜元件。
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公开(公告)号：US20230401889A1
公开(公告)日：2023-12-14
申请号：US17839000
申请日：2022-06-13
Applicant: OmniVision Technologies, Inc.
Inventor： Jau-Jan DENG , Yi-Wei LIU
CPC classification number: G06V40/1318 , H04M1/0266 , G06F3/0412 , G06F3/042
Abstract: An image sensor for imaging fingerprints has multiple photodiode groups each with field of view through a microlens determined by optical characteristics of the microlens and locations of the microlens and openings of upper and lower mask layers. Many photodiode groups have fields of view outwardly splayed from a center-direct field of view. A diameter of openings of the upper mask layer distant from the group having a center-direct field of view is larger than openings of a photodiode group having a center-direct field of view. A method of matching illumination of a group of photodiodes with center-direct field of view to illumination of photodiode groups having outwardly splayed fields of view includes sizing openings in the upper mask layer of photodiode groups with outwardly splayed fields of view larger than openings in the upper mask layer associated with photodiode groups having center-direct field of view.
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5.发明公开公开(公告)号：US20230386247A1
公开(公告)日：2023-11-30
申请号：US17824786
申请日：2022-05-25
Applicant: OmniVision Technologies, Inc.
Inventor： Jau-Jan DENG , Yi-Wei LIU
IPC: G06V40/13 , H01L27/146 , H01L27/32
CPC classification number: G06V40/1318 , H01L27/14627 , H01L27/14643 , H01L27/3227 , H01L27/323
Abstract: An image sensor for imaging fingerprints has multiple photodiode groups each having a field of view determined by pinholes of upper and lower mask layers and a metal layer, each field of view being through a microlens. Many photodiode groups have fields of view outwardly splayed from a group having a center-direct field of view. A diameter of pinholes of the metal layer distant from the group having a center-direct field of view have larger diameter than a pinhole of the photodiode group having a center-direct field of view. A method of matching illumination of a group of photodiodes with center-direct field of view to illumination of photodiode groups having outwardly splayed fields of view includes sizing a pinhole in the metal layer of photodiode groups with outwardly splayed fields of view larger than a pinhole associated with of photodiode groups having a center-direct field of view.
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Patent Agency Ranking
公开(公告)号：US20180100992A1
公开(公告)日：2018-04-12
申请号：US15286932
申请日：2016-10-06
Applicant: OmniVision Technologies, Inc.
Inventor： Chuen-Yi YIN , Jau-Jan DENG
CPC classification number: G02B13/0045 , G02B9/64 , G06K9/00604 , H04M1/026
Abstract: A six-aspheric-surface lens has six coaxially aligned lenses including, in order, a positive first lens, a negative second lens, a negative third lens, a negative fourth lens, a negative fifth lens, and a plano-gull-wing sixth lens. The six-aspheric-surface lens also includes a first biplanar substrate between the first lens and the second lens, a second biplanar substrate between the third lens and the fourth lens, and a third biplanar substrate between the fifth lens and the sixth lens. The first lens may have an Abbe number exceeding 48, the second lens and the third lens each may have an Abbe number less than 35. The first lens may have a focal length f1 and the second lens may have a focal length f2 such that −0.27
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公开(公告)号：US20240236465A1
公开(公告)日：2024-07-11
申请号：US18095401
申请日：2023-01-10
Applicant: OmniVision Technologies, Inc.
Inventor： I-Lung LU , Jau-Jan DENG , Wei-Ping CHEN
Abstract: A self-illuminating camera includes a camera and an illuminator. The camera includes an image sensor and a first lens of a pair of two identical lenses. The illuminator is adjacent to the camera and includes a light source and a second lens of the pair of two identical lenses. The illuminator has a field of illumination that at least partially overlaps a field of view of the camera.
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公开(公告)号：US20230351798A1
公开(公告)日：2023-11-02
申请号：US17730688
申请日：2022-04-27
Applicant: OmniVision Technologies, Inc.
Inventor： Tsung-Wei WAN , Wei-Ping CHEN , Jau-Jan DENG
IPC: G06V40/13 , G02B3/00 , H01L27/146
CPC classification number: G06V40/1318 , G02B3/0037 , H01L27/1462 , H01L27/14623 , H01L27/14627 , H01L27/14678 , H01L27/14685 , H01L27/14698
Abstract: A fingerprint sensor has an array of microlenses formed on an upper surface of a transparent substrate; with a lower surface of the transparent substrate bonded to an upper surface of a fingerprint image sensor integrated circuit. In embodiments, it includes one or two filter layers on the lower surface of the transparent substrate, and may also include masked black baffle layers on one or more of the upper and lower surface of the transparent substrate. The sensor is made by forming the microlenses and black baffle layers on the transparent substrate, then aligning the transparent substrate to a wafer of fingerprint sensor integrated circuits and bonding the transparent substrate to the wafer, then dicing the wafer into individual fingerprint sensors.
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公开(公告)号：US20230262310A1
公开(公告)日：2023-08-17
申请号：US17674675
申请日：2022-02-17
Applicant: OmniVision Technologies, Inc.
Inventor： Teng-Sheng CHEN , Wei-Ping CHEN , Jau-Jan DENG , Wei-Feng LIN
IPC: H04N5/225
CPC classification number: H04N5/2256 , H04N5/2257 , H04N5/2254
Abstract: An electronic camera assembly includes a camera chip cube bonded to camera bondpads of an interposer; at least one light-emitting diode (LED) bonded to LED bondpads of the interposer at the same height as the camera bondpads; and a housing extending from the interposer and LEDs to the height of the camera chip cube, with light guides extending from the LEDs through the housing to a top of the housing. In embodiments, the electronic camera assembly includes a cable coupled to the interposer. In typical embodiments the camera chip cube has footprint dimensions of less than three and a half millimeters square.
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公开(公告)号：US20230118866A1
公开(公告)日：2023-04-20
申请号：US17747803
申请日：2022-05-18
Applicant: OmniVision Technologies, Inc.
Inventor： Teng-Sheng CHEN , Wei-Ping CHEN , Wei-Feng LIN , Jau-Jan DENG
Abstract: A cavity interposer has a cavity, first bondpads adapted to couple to a chip-type camera cube disposed within a base of the cavity at a first level, the first bondpads coupled through feedthroughs to second bondpads at a base of the interposer at a second level; and third bondpads adapted to couple to a light-emitting diode (LED), the third bondpads at a third level. The third bondpads coupled to fourth bondpads at the base of the interposer at the second level; and the second and fourth bondpads couple to conductors of a cable with the first, second, and third level different. An endoscope optical includes the cavity interposer an LED, and a chip-type camera cube electrically bonded to the first bondpads; the LED is bonded to the third bondpads; and a top of the chip-type camera cube and a top of the LED are at a same level.
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