CHARACTERIZATION OF PATTERNED STRUCTURES USING ACOUSTIC METROLOGY

    公开(公告)号:US20210318270A1

    公开(公告)日:2021-10-14

    申请号:US17217527

    申请日:2021-03-30

    IPC分类号: G01N29/24 G01N29/06

    摘要: Systems and methods for inspecting or characterizing samples, such as by characterizing patterned features or structures of the sample. In an aspect, the technology relates to a method for characterizing a patterned structure of a sample. The method includes directing a pump beam to a first position on a surface of the sample to induce a surface acoustic wave in the sample and directing a probe beam to a second position on the sample, wherein the probe beam is affected by the surface acoustic wave when the probe beam reflects from the surface of the sample. The method also includes detecting the reflected probe beam, analyzing the detected reflected probe beam to identify a frequency mode in the reflected probe beam, and based on the identified frequency mode, determining at least one of a width or a pitch of a patterned feature in the sample.

    Non-destructive inspection and manufacturing metrology systems and methods

    公开(公告)号:US12092565B2

    公开(公告)日:2024-09-17

    申请号:US17613318

    申请日:2020-05-22

    IPC分类号: G01N21/17

    CPC分类号: G01N21/1702

    摘要: Measuring or inspecting samples through non-destructive systems and methods. Multiple light pulses emitted from a light source. The light pulses are split into pump pulses and probe pulses. A first probe pulse reaches the surface of a sample after a first time duration after a first pump pulse reaches the surface. A second pump pulse reaches the surface after a time duration after the first probe pulse. When the second pump pulse reflects off the sample, the second pump pulse may be altered by an acoustic wave generated by the first probe pulse. The reflected second pump pulse may be analyzed to determine a characteristic of the sample.

    Characterization of patterned structures using acoustic metrology

    公开(公告)号:US11988641B2

    公开(公告)日:2024-05-21

    申请号:US17217527

    申请日:2021-03-30

    IPC分类号: G01N29/24 G01N29/06

    摘要: Systems and methods for inspecting or characterizing samples, such as by characterizing patterned features or structures of the sample. In an aspect, the technology relates to a method for characterizing a patterned structure of a sample. The method includes directing a pump beam to a first position on a surface of the sample to induce a surface acoustic wave in the sample and directing a probe beam to a second position on the sample, where the probe beam is affected by the surface acoustic wave when the probe beam reflects from the surface of the sample. The method also includes detecting the reflected probe beam, analyzing the detected reflected probe beam to identify a frequency mode in the reflected probe beam, and based on the identified frequency mode, determining at least one of a width or a pitch of a patterned feature in the sample.

    A SYSTEM AND METHOD FOR PERFORMING ALIGNMENT AND OVERLAY MEASUREMENT THROUGH AN OPAQUE LAYER

    公开(公告)号:US20240004311A1

    公开(公告)日:2024-01-04

    申请号:US18253581

    申请日:2021-11-22

    IPC分类号: G03F7/00

    CPC分类号: G03F7/70633 G03F7/706849

    摘要: An alignment or overlay target that has an optically opaque layer disposed between the top and bottom target structure is measured using opto-acoustic metrology. A classifier library is generated for classifying whether an opto-acoustic metrology signal is on or off the bottom structure. A target may be measured by acquiring opto-acoustic measurement data for the bottom structure of the target and determining a location of the bottom structure using opto-acoustic metrology data acquired from the different locations over the bottom structure and the classifier library. Locations for acquisition of the data may be based on classification results of each measurement and a search pattern. The top structure of the target may be optically imaged. The relative position of the top structure with respect to the bottom structure is determined using the opto-acoustically determined location of the bottom structure and the image of the top structure.