公开(公告)号：US20170263457A1

公开(公告)日：2017-09-14

申请号：US15452005

申请日：2017-03-07

Applicant: Ostendo Technologies, Inc.

Inventor： Hussein S. El-Ghoroury ,  Minghsuan Liu ,  Kameshwar Yadavalli ,  Weilong Tang ,  Benjamin A. Haskell ,  Hailong Zhou

IPC: H01L21/18 ,  H01L21/687 ,  H01L21/762 ,  H01L21/67

CPC classification number: H01L21/187 ,  H01L21/26 ,  H01L21/67115 ,  H01L21/68764 ,  H01L21/76251 ,  H01L22/12

Abstract: An electromagnetic wave irradiation apparatus and methods to bond unbonded areas in a bonded pair of substrates are disclosed. The unbonded areas between the substrates are eliminated by thermal activation in the unbonded areas induced by electromagnetic wave irradiation having a wavelength selected to effect a phonon or electron excitation. A first substrate of the bonded pair of substrates absorbs the electromagnetic radiation and a portion of a resulting thermal energy transfers to an interface of the bonded pair of substrates at the unbonded areas with sufficient flux to cause opposite sides the first and second substrates to interact and dehydrate to form a bond (e.g., Si—O—Si bond).

公开(公告)号：US10373830B2

公开(公告)日：2019-08-06

申请号：US15452005

申请日：2017-03-07

Applicant: Ostendo Technologies, Inc.

Inventor： Hussein S. El-Ghoroury ,  Minghsuan Liu ,  Kameshwar Yadavalli ,  Weilong Tang ,  Benjamin A. Haskell ,  Hailong Zhou

IPC: H01L21/67 ,  H01L21/687 ,  H01L21/66 ,  H01L21/26 ,  H01L21/18 ,  H01L21/762

Abstract: An electromagnetic wave irradiation apparatus and methods to bond unbonded areas in a bonded pair of substrates are disclosed. The unbonded areas between the substrates are eliminated by thermal activation in the unbonded areas induced by electromagnetic wave irradiation having a wavelength selected to effect a phonon or electron excitation. A first substrate of the bonded pair of substrates absorbs the electromagnetic radiation and a portion of a resulting thermal energy transfers to an interface of the bonded pair of substrates at the unbonded areas with sufficient flux to cause opposite sides the first and second substrates to interact and dehydrate to form a bond (e.g., Si—O—Si bond).