公开(公告)号：US20220119148A1

公开(公告)日：2022-04-21

申请号：US17499389

申请日：2021-10-12

Applicant: Packsize LLC

Inventor： HANKO KIESSNER ,  JOHN PAUL ALPINE

IPC: B65D5/42 ,  B65B59/00

Abstract: Customized boxes for packaging one or more items therein can have item placement indicia printed, applied, or projected thereon. The boxes can include a plurality of side wall panels and a plurality of flaps extending from the plurality of sidewall panels. The plurality of flaps can be configured to form top and bottom surfaces of the customized boxes. The item placement indicia can be printed, applied, or projected on an interior surface of one or more of the side wall panels. The item placement indicia represent desired placements for the one or more items to be packaged in the customized boxes.

公开(公告)号：US20240383222A1

公开(公告)日：2024-11-21

申请号：US18787712

申请日：2024-07-29

Applicant: PACKSIZE LLC

Inventor： HANKO KIESSNER ,  JOHN PAUL ALPINE

IPC: B31F5/00

Abstract: A method for making a dual fluted corrugated board includes providing a first single face corrugated board having a liner layer and a fluted layer attached to the liner layer and providing a second single face corrugated board having a liner layer and a fluted layer attached to the liner layer. The method also includes arranging the first single face corrugated board and the second single face corrugated board such that the fluted layers thereof face one another and attaching the first single face corrugated board to the second single face corrugated board.

公开(公告)号：US20230294376A1

公开(公告)日：2023-09-21

申请号：US18325893

申请日：2023-05-30

Applicant: Packsize LLC

Inventor： HANKO KIESSNER

IPC: B31F1/28 ,  B32B3/28 ,  B32B29/08

CPC classification number: B31F1/2818 ,  B31F1/285 ,  B32B3/28 ,  B32B29/08

Abstract: Systems and methods for forming corrugated boards are disclosed. The system includes a single face unit configured to form a single face board having a fluted layer and an outer liner. The system also includes a single face buffer configured to store or hold a length of the single face board. The system has a glue station configured to attach a second outer liner to the single face board to form a single wall board. The system also has an ultrasonic unit configured to apply ultrasonic vibrations to the single wall board. The ultrasonic vibrations are configured to remove moisture from the single wall board, activate, heat, and/or dry an adhesive used to attach the fluted layer and the outer liners, and/or cause the fibers of the fluted layer and the outer liners to weave, intertwine, or otherwise stick together.

公开(公告)号：US20220266567A1

公开(公告)日：2022-08-25

申请号：US17474933

申请日：2021-09-14

Applicant: Packsize LLC

Inventor： HANKO KIESSNER

IPC: B31F1/28 ,  B32B29/08 ,  B32B3/28

Abstract: Systems and methods for forming corrugated boards are disclosed. The system includes a single face unit configured to form a single face board having a fluted layer and an outer liner. The system also includes a single face buffer configured to store or hold a length of the single face board. The system has a glue station configured to attach a second outer liner to the single face board to form a single wall board. The system also has an ultrasonic unit configured to apply ultrasonic vibrations to the single wall board. The ultrasonic vibrations are configured to remove moisture from the single wall board, activate, heat, and/or dry an adhesive used to attach the fluted layer and the outer liners, and/or cause the fibers of the fluted layer and the outer liners to weave, intertwine, or otherwise stick together.