-
公开(公告)号:US20170302869A1
公开(公告)日:2017-10-19
申请号:US15636088
申请日:2017-06-28
Inventor: Makoto IKUMA , Manabu TSUNODA , Kenji WATANABE , Kenichi HAGA , Masaru KATO
CPC classification number: H04N5/365 , H04N5/3658 , H04N5/374 , H04N5/378
Abstract: A solid-state imaging device includes: a pixel array including a plurality of pixel circuits arranged in rows and columns; a vertical signal line that is provided for each of the columns and transmits pixel signals; a column AD circuit that is provided for each of the columns and AD converts the pixel signals from the vertical signal line; a column-switching circuit that is interposed in the vertical signal line between the pixel array and the column AD circuit and switches connection between the vertical signal line and the column AD circuit; a controller that causes the column-switching circuit to switch the connection for every horizontal scan period; and a restoration circuit that restores ordering of the AD converted signals so as to correspond to ordering in which the vertical signal lines are arranged in the pixel array.