公开(公告)号：US20200310055A1

公开(公告)日：2020-10-01

申请号：US16831986

申请日：2020-03-27

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD

Inventor： Mark MORDARSKI ,  Bryan LOCHMAN ,  Francisco VILLARREAL-SAUCEDO

IPC: G02B6/42 ,  B23K26/0622 ,  B23K26/064 ,  B23K26/073 ,  B23K26/06

Abstract: In various embodiments, laser emissions are steered into different regions of an optical fiber, and/or into different optical fibers, in a temporal pattern such that an output has different spatial output profiles. The temporal pattern has a frequency sufficient such that a workpiece is processed by an effective output shape combining the different spatial output profiles.

公开(公告)号：US20240109154A1

公开(公告)日：2024-04-04

申请号：US18538201

申请日：2023-12-13

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD

Inventor： Wang-Long ZHOU ,  Francisco VILLARREAL-SAUCEDO ,  Bien CHANN ,  Mark MORDARSKI ,  Bryan LOCHMAN

IPC: B23K26/34 ,  B23K26/0622

CPC classification number: B23K26/34 ,  B23K26/0624 ,  B23K2103/50

Abstract: In various embodiments, laser beams of two different wavelengths are utilized, sequentially and/or simultaneously, to process workpieces in various processing stages such as melting, piercing, cutting, and welding.

公开(公告)号：US20230333339A1

公开(公告)日：2023-10-19

申请号：US18339563

申请日：2023-06-22

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Mark MORDARSKI ,  Bryan Lochman ,  Francisco Villarreal-Saucedo

IPC: B23K26/073 ,  G02B6/42 ,  B23K26/064 ,  B23K26/0622 ,  B23K26/06

CPC classification number: G02B6/4296 ,  B23K26/0604 ,  B23K26/0622 ,  B23K26/064 ,  B23K26/0734

Abstract: In various embodiments, laser emissions are steered into different regions of an optical fiber, and/or into different optical fibers, in a temporal pattern such that an output has different spatial output profiles. The temporal pattern has a frequency sufficient such that a workpiece is processed by an effective output shape combining the different spatial output profiles.

公开(公告)号：US20210039200A1

公开(公告)日：2021-02-11

申请号：US16984489

申请日：2020-08-04

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Wang-Long ZHOU ,  Francisco VILLARREAL-SAUCEDO ,  Bien CHANN ,  Mark MORDARSKI ,  Bryan LOCHMAN

IPC: B23K26/34 ,  B23K26/0622

Abstract: In various embodiments, laser beams of two different wavelengths are utilized, sequentially and/or simultaneously, to process workpieces in various processing stages such as melting, piercing, cutting, and welding.