Hot melt adhesive formulation
    2.
    发明授权
    Hot melt adhesive formulation 失效
    热熔胶粘剂配方

    公开(公告)号:US3798118A

    公开(公告)日:1974-03-19

    申请号:US3798118D

    申请日:1972-06-06

    Inventor: JONES F

    Abstract: HOT MELT ADHESIVE COMPOSITIONS WITH SUPERIOR RESISTANCE TO HIGH TEMPERATURE LOSS OF STRENGTH ARE PREPARED FROM CONVENTIONAL INGREDIENTS INCLUDING RESIN TACKIFIERS AND WAXES PLUS A HIGH MELT FLOW RESINOUS POLYMER OF PROPYLENE THE ADHESIVES FORMULATIONS CAN CONTAIN ABOUT 20 TO 90 WEIGHT PARTS OF SUBSTANTIALLY CRYSTALLINE RESINOUS PROPYLENE POLYMER WHICH INCLUDES HOMOPOLYMERS OF PROPYLENE, AND COPOLYMERS OF ETHYLENE AND PROPYLENE AND 10 TO 80 WEIGHT PARTS OF RESIN TACKIFIER AND OPTIONALLY A PROPORTION OF WAX PER 100 PARTS OF TOTAL ADHESIVE FORMULATION. THE COMPOSITIONS CAN BE USED AS SEALANTS OR ADHESIVES IN PRODUCING LAMINATES WHICH CAN THEN BE EXPOSED TO BOILING WATER OR STEAM WITHOUT ADHESIVE FAILURE.

    Method of bonding using a polyamide resin
    5.
    发明授权
    Method of bonding using a polyamide resin 失效
    使用聚酰胺树脂粘合的方法

    公开(公告)号:US3790423A

    公开(公告)日:1974-02-05

    申请号:US3790423D

    申请日:1971-11-22

    Inventor: JONES F

    CPC classification number: C08G69/265 C08G69/26 Y10T428/31681

    Abstract: Polyamides, useful as hot-melt adhesives, are prepared by condensing: (a) mixtures of at least two reaction products selected from the group consisting of the reaction product of a diamine and isophthalic acid, the reaction product of a diamine and terephthalic acid, and the reaction product of a diamine and a mixture of isophthalic acid and terephthalic acid or (b) the reaction product of a diamine and a mixture of isophthalic acid and terephthalic acid.

    Abstract translation: 可用作热熔粘合剂的聚酰胺通过以下方法制备:(a)选自二胺和间苯二甲酸的反应产物,二胺与对苯二甲酸的反应产物,对苯二甲酸的反应产物, 和二胺与间苯二甲酸和对苯二甲酸的混合物的反应产物,或(b)二胺与间苯二甲酸和对苯二甲酸的混合物的反应产物。

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