公开(公告)号：US20190081097A1

公开(公告)日：2019-03-14

申请号：US15701051

申请日：2017-09-11

Applicant: PIXART IMAGING INC.

Inventor： CHI-CHIH SHEN ,  KUO-HSIUNG LI ,  JUI-CHENG CHUANG

IPC: H01L27/146 ,  H01L31/153

CPC classification number: H01L27/14618 ,  G06F21/32 ,  H01L27/14621 ,  H01L27/14685 ,  H01L27/1469 ,  H01L31/153 ,  H01L31/167

Abstract: An optical sensor package module and a manufacturing method thereof are provided. The optical sensor package module includes a substrate, a sensor chip and a shielding assembly. The sensor chip is disposed on the substrate and includes an array of pixels located at a top side thereof for receiving light. The shielding assembly surrounds the sensor chip for limiting influx of light onto the sensor chip, and the shielding assembly has a first aperture to expose at least a first subset of the pixels that is configured to receive corresponding light.

公开(公告)号：US20180087958A1

公开(公告)日：2018-03-29

申请号：US15479048

申请日：2017-04-04

Applicant: PIXART IMAGING INC.

Inventor： CHI-CHIH SHEN ,  KUO-HSIUNG LI ,  SHANG-FENG HSIEH ,  JUI-CHENG CHUANG

IPC: G01J1/02 ,  G01D5/34

CPC classification number: G01J1/0271 ,  G01D5/34707 ,  G01D11/245 ,  G01J1/0204 ,  G01J1/0214 ,  H01L27/14618

Abstract: The present disclosure discloses an optical module package structure and method thereof. The optical module includes a substrate, a shield, a photosensitive unit and a cover. The shield is disposed on the top of the substrate and forms a first housing space with the upper surface of the substrate. The photosensitive unit is disposed on the substrate and located in the first housing space. The shield has a light-receiving part above the photosensitive unit. At least one notch is on the outer surface of the shield. A cushion is disposed on the notch and protrudes on the upper surface of the shield. The cover is disposed on the cushion(s) and kept a constant distance to the upper surface of the shield by contacting with the cushion(s).