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    OPTICAL COMPONENT PACKAGING STRUCTURE
    1.
    发明申请
    OPTICAL COMPONENT PACKAGING STRUCTURE 有权

    公开(公告)号：US20180122960A1

    公开(公告)日：2018-05-03

    申请号：US15607393

    申请日：2017-05-26

    Applicant: PIXART IMAGING INC.

    Inventor： YI-CHANG CHANG ,  YEN-HSIN CHEN ,  CHI-CHIH SHEN

    IPC: H01L31/0203 ,  H01L27/146 ,  H01L31/0236

    CPC classification number: H01L31/0203 ,  H01L27/14601 ,  H01L27/14625 ,  H01L27/14685 ,  H01L31/02164 ,  H01L31/02363 ,  H01L31/024 ,  H01L31/095

    Abstract: The instant disclosure provides an optical component packaging structure which includes a far-infrared sensor chip, a first metal layer, a packaging housing and a covering member. The far-infrared sensor chip includes a semiconductor substrate and a semiconductor stack structure. The semiconductor substrate has a first surface, a second surface which is opposite to the first surface, and a cavity. The semiconductor stack structure is disposed on the first surface of the semiconductor substrate, and a part of the semiconductor stack structure is located above the cavity. The first metal layer is disposed on the second surface of the semiconductor substrate, the packaging housing is used to encapsulate the far-infrared sensor chip and expose at least a part of the far-infrared sensor chip, and the covering member is disposed above the semiconductor stack structure.

    MANUFACTURING METHOD OF SENSOR CHIP PACKAGE STRUCTURE
    2.
    发明申请
    MANUFACTURING METHOD OF SENSOR CHIP PACKAGE STRUCTURE 审中-公开

    公开(公告)号：US20200251606A1

    公开(公告)日：2020-08-06

    申请号：US16855702

    申请日：2020-04-22

    Applicant: PIXART IMAGING INC.

    Inventor： CHI-CHIH SHEN

    IPC: H01L31/147 ,  H01L23/31 ,  H01L31/14 ,  H01L31/18 ,  H01L31/0203 ,  H01L31/02 ,  H01L31/0216

    Abstract: A manufacturing method of a sensor chip package structure is provided. In the manufacturing method, a wafer including a plurality of sensor chips is provided, and each sensor chip has an active region and defines a pre-thinned region thereon. Each pre-thinned region is located at one side of the active region and covers a boundary line of each sensor chip. The pre-thinned region of each sensor chip is etched to form a concave portion. A redistribution layer is formed on the wafer. Subsequently, the wafer is cut to separate the sensor chips from one another, and each separated sensor chip has a wiring layer extending from the active region along a sidewall surface to a bottom surface of the concave portion. The separated sensor chips are respectively mounted on a plurality of substrates, and the active region is electrically connected to the substrate through the wiring layer.

    OPTICAL COMPONENT PACKAGING STRUCTURE
    3.
    发明申请
    OPTICAL COMPONENT PACKAGING STRUCTURE 有权

    公开(公告)号：US20210091238A1

    公开(公告)日：2021-03-25

    申请号：US17113349

    申请日：2020-12-07

    Applicant: PIXART IMAGING INC.

    Inventor： YI-CHANG CHANG ,  YEN-HSIN CHEN ,  CHI-CHIH SHEN

    IPC: H01L31/0203 ,  H01L27/146 ,  H01L31/0236 ,  G01J5/00 ,  G01J5/04 ,  G01J5/20

    Abstract: The instant disclosure provides an optical component packaging structure which includes a far-infrared sensor chip, a first metal layer, a packaging housing and a covering member. The far-infrared sensor chip includes a semiconductor substrate and a semiconductor stack structure. The semiconductor substrate has a first surface, a second surface which is opposite to the first surface, and a cavity. The semiconductor stack structure is disposed on the first surface of the semiconductor substrate, and a part of the semiconductor stack structure is located above the cavity. The first metal layer is disposed on the second surface of the semiconductor substrate, the packaging housing is used to encapsulate the far-infrared sensor chip and expose at least a part of the far-infrared sensor chip, and the covering member is disposed above the semiconductor stack structure.

    OPTICAL SENSOR PACKAGE MODULE AND MANUFACTURING METHOD THEREOF
    4.
    发明申请
    OPTICAL SENSOR PACKAGE MODULE AND MANUFACTURING METHOD THEREOF 审中-公开

    公开(公告)号：US20190267419A1

    公开(公告)日：2019-08-29

    申请号：US16410357

    申请日：2019-05-13

    Applicant: PIXART IMAGING INC.

    Inventor： CHI-CHIH SHEN

    IPC: H01L27/146 ,  G06F21/32 ,  G06K9/00

    Abstract: An optical sensor package module and a manufacturing method thereof are provided. The optical sensor package module includes a substrate, a sensor chip and a shielding assembly. The sensor chip is disposed on the substrate and includes an array of pixels located at a top side thereof for receiving light. The shielding assembly surrounds the sensor chip for limiting influx of light onto the sensor chip, and the shielding assembly has a first aperture to expose at least a first subset of the pixels that is configured to receive corresponding light.

    OPTICAL COMPONENT PACKAGING STRUCTURE
    6.
    发明申请
    OPTICAL COMPONENT PACKAGING STRUCTURE 有权

    公开(公告)号：US20230020236A1

    公开(公告)日：2023-01-19

    申请号：US17955854

    申请日：2022-09-29

    Applicant: PIXART IMAGING INC.

    Inventor： YI-CHANG CHANG ,  YEN-HSIN CHEN ,  CHI-CHIH SHEN

    IPC: H01L31/0203 ,  H01L27/146 ,  H01L31/0236 ,  G01J5/00 ,  G01J5/04 ,  G01J5/20

    Abstract: An optical component packaging structure is provided. The optical component packaging structure includes a substrate, a far-infrared sensor chip, a metal covering cap and a light filter. The far-infrared sensor chip is disposed on the substrate and electrically connected to the substrate. The metal covering cap is disposed on the substrate and accommodating the far-infrared sensor chip. The metal covering cap has an opening exposing the far-infrared sensor chip. The light filter is disposed out of the opening and on the inner surface for covering the opening to filter the far-infrared light passing through. The far-infrared sensor chip is surrounded by the metal covering cap, the substrate and the light filter, and the metal covering cap is directly connected with the substrate.

    OPTICAL MODULE PACKAGE STRUCTURE AND METHOD THEREOF
    8.
    发明申请
    OPTICAL MODULE PACKAGE STRUCTURE AND METHOD THEREOF 审中-公开

    公开(公告)号：US20180087958A1

    公开(公告)日：2018-03-29

    申请号：US15479048

    申请日：2017-04-04

    Applicant: PIXART IMAGING INC.

    Inventor： CHI-CHIH SHEN ,  KUO-HSIUNG LI ,  SHANG-FENG HSIEH ,  JUI-CHENG CHUANG

    IPC: G01J1/02 ,  G01D5/34

    CPC classification number: G01J1/0271 ,  G01D5/34707 ,  G01D11/245 ,  G01J1/0204 ,  G01J1/0214 ,  H01L27/14618

    Abstract: The present disclosure discloses an optical module package structure and method thereof. The optical module includes a substrate, a shield, a photosensitive unit and a cover. The shield is disposed on the top of the substrate and forms a first housing space with the upper surface of the substrate. The photosensitive unit is disposed on the substrate and located in the first housing space. The shield has a light-receiving part above the photosensitive unit. At least one notch is on the outer surface of the shield. A cushion is disposed on the notch and protrudes on the upper surface of the shield. The cover is disposed on the cushion(s) and kept a constant distance to the upper surface of the shield by contacting with the cushion(s).

    OPTICAL COMPONENT PACKAGING STRUCTURE
    9.
    发明申请
    OPTICAL COMPONENT PACKAGING STRUCTURE 审中-公开

    公开(公告)号：US20180269337A1

    公开(公告)日：2018-09-20

    申请号：US15979708

    申请日：2018-05-15

    Applicant: PIXART IMAGING INC.

    Inventor： YI-CHANG CHANG ,  YEN-HSIN CHEN ,  CHI-CHIH SHEN

    IPC: H01L31/0203 ,  H01L27/146 ,  H01L31/0236 ,  H01L31/024 ,  H01L31/09 ,  H01L31/0216

    CPC classification number: H01L31/0203 ,  G01J5/00 ,  H01L27/14601 ,  H01L27/14625 ,  H01L27/14685

    Abstract: The instant disclosure provides an optical component packaging structure which includes a far-infrared sensor chip, a first metal layer, a packaging housing and a covering member. The far-infrared sensor chip includes a semiconductor substrate and a semiconductor stack structure. The semiconductor substrate has a first surface, a second surface which is opposite to the first surface, and a cavity. The semiconductor stack structure is disposed on the first surface of the semiconductor substrate, and a part of the semiconductor stack structure is located above the cavity. The first metal layer is disposed on the second surface of the semiconductor substrate, the packaging housing is used to encapsulate the far-infrared sensor chip and expose at least a part of the far-infrared sensor chip, and the covering member is disposed above the semiconductor stack structure.

    SENSOR CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
    10.
    发明申请
    SENSOR CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF 有权
    传感器芯片包装结构及其制造方法

    公开(公告)号：US20170062628A1

    公开(公告)日：2017-03-02

    申请号：US15096601

    申请日：2016-04-12

    Applicant: PIXART IMAGING INC.

    Inventor： CHI-CHIH SHEN ,  YEN-HSIN CHEN ,  YI-CHANG CHANG

    IPC: H01L31/0203 ,  H01L31/02 ,  H01L31/18 ,  H01L31/14

    CPC classification number: H01L31/0203 ,  H01L31/02005 ,  H01L31/143 ,  H01L31/18 ,  H01L31/1876 ,  H01L2224/48091 ,  H01L2924/10155 ,  H01L2924/00014

    Abstract: A sensor chip package structure and a manufacturing method thereof are provided. The sensor chip package structure includes a substrate, a sensor chip and a wiring layer. The sensor chip is mounted on the substrate and has a top surface and a concave portion concaved from the top surface. The sensor chip has an active region formed on the top surface and the concave portion is located at one side of the active region. The concave portion has a depth of 100 μm to 400 μm. The wiring layer is disposed on the sensor chip and electrically connected to the active region. At least a portion of the wiring layer extends from the active region along a sidewall of the concave portion to a bottom surface of the concave portion.

    Abstract translation: 提供一种传感器芯片封装结构及其制造方法。 传感器芯片封装结构包括基板，传感器芯片和布线层。 传感器芯片安装在基板上，具有从上表面凹下的顶面和凹部。 传感器芯片具有形成在顶表面上的有源区，凹部位于有源区的一侧。 凹部的深度为100μm〜400μm。 布线层设置在传感器芯片上并电连接到有源区。 布线层的至少一部分从活性区域沿着凹部的侧壁延伸到凹部的底面。

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