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公开(公告)号：US20190314533A1
公开(公告)日：2019-10-17
申请号：US16383406
申请日：2019-04-12
Applicant: POINT ENGINEERING CO.,LTD.
Inventor： Bum Mo AHN , Seung Ho PARK , Moon Hyun KIM
Abstract: The present invention relates generally to an ultraviolet sterilization module for sterilizing a fluid using ultraviolet light. More particularly, the present invention relates to an ultraviolet sterilization module, configured such that an increase in amount of ultraviolet irradiation is achieved, thus efficiently sterilizing a fluid inside a light transmission member without requiring an increase in size of the light transmission member.
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公开(公告)号：US20190097090A1
公开(公告)日：2019-03-28
申请号：US16144857
申请日：2018-09-27
Applicant: POINT ENGINEERING CO., LTD.
Inventor： Bum Mo AHN , Seung Ho PARK , Moon Hyun KIM
Abstract: Disclosed is a unit substrate for an optical device, the unit substrate including: an optical device-mounting region provided on an upper surface of the unit substrate; and first and second metal substrates bonded to each other with a vertical insulating layer interposed therebetween. A lower surface of the unit substrate is electrically connected to the mounting region, and side and upper surfaces of the unit substrate are electrically isolated from the mounting region such that an optical device is capable of operating in an environment with low electrical resistance.
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公开(公告)号：US20210313491A1
公开(公告)日：2021-10-07
申请号：US17351019
申请日：2021-06-17
Applicant: POINT ENGINEERING CO., LTD.
Inventor： Bum Mo AHN , Seung Ho PARK , Moon Hyun KIM
Abstract: An optical component package includes a main substrate including a plurality of metal bodies, and a vertical insulation part provided between the metal bodies; a cavity provided in an upper surface of the main substrate; a sub-substrate provided in the cavity of the main substrate, the sub-substrate including an insulating body, a plurality of via holes vertically passing through the insulating body and filled with a metal material being electrically connected to each of the metal bodies, and a plurality of metal pads mounted on the insulating body and electrically connected to the plurality of via holes; a plurality of optical components mounted on the plurality of metal pads and electrically connected to the plurality of metal pads; and a light transmitting member provided above the main substrate.
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公开(公告)号：US20190319178A1
公开(公告)日：2019-10-17
申请号：US16383462
申请日：2019-04-12
Applicant: POINT ENGINEERING CO., LTD.
Inventor： Bum Mo AHN , Seung Ho PARK , Moon Hyun KIM
Abstract: The present invention relates generally to an optical device package on which an optical device is mounted and, more particularly, to an optical device package that is configured such that a unit substrate of the optical device package comes into surface contact with a curved surface of a light transmission member.
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