中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

253 records (took 0.02 seconds)

    Semiconductor probe pin
    3.
    外观设计
    Semiconductor probe pin 有权

    公开(公告)号：USD1030689S1

    公开(公告)日：2024-06-11

    申请号：US29858093

    申请日：2022-10-28

    Applicant: POINT ENGINEERING CO., LTD.

    Designer： Bum Mo Ahn

    Abstract: FIG. 1 is a perspective view of a semiconductor probe pin showing my new design;
    FIG. 2 is a front view thereof;
    FIG. 3 is a rear view thereof;
    FIG. 4 is a left side view thereof;
    FIG. 5 is a right side view thereof;
    FIG. 6 is a top view thereof; and,
    FIG. 7 is a bottom view thereof.

    Probe head and probe card having same
    6.
    发明授权
    Probe head and probe card having same 有权

    公开(公告)号：US11860192B2

    公开(公告)日：2024-01-02

    申请号：US17161460

    申请日：2021-01-28

    Applicant: POINT ENGINEERING CO., LTD.

    Inventor： Bum Mo Ahn ,  Seung Ho Park ,  Sung Hyun Byun

    IPC: G01R1/073

    CPC classification number: G01R1/07314

    Abstract: Proposed are a probe head and a probe card having the same. According to the present disclosure, the probe head of the probe card includes: an upper guide plate having an upper guide hole; a lower guide plate having a lower guide hole; and an intermediate guide plate having an intermediate guide hole and provided between the upper guide plate and the lower guide plate, wherein each of a plurality of probes sequentially passes through the upper guide hole, the intermediate guide hole, and the lower guide hole, and the intermediate guide plate is made of an anodic oxide film.

    MULTILAYER CERAMIC SUBSTRATE AND PROBE CARD INCLUDING SAME
    9.
    发明申请
    MULTILAYER CERAMIC SUBSTRATE AND PROBE CARD INCLUDING SAME 有权

    公开(公告)号：US20220359124A1

    公开(公告)日：2022-11-10

    申请号：US17873020

    申请日：2022-07-25

    Applicant: POINT ENGINEERING CO., LTD.

    Inventor： Bum Mo AHN ,  Seung Ho PARK ,  Sung Hyun BYUN

    IPC: H01G4/40 ,  H01G4/12

    Abstract: A multilayer ceramic substrate according to the present invention includes a first insulating portion including a body of a ceramic material, a first via conductor penetrating through the body, and a first internal wiring layer and a first connection pad connected to the first via conductor; and a second insulating portion including a body of an anodized oxide material, a second via conductor penetrating through the body, and a second internal wiring layer and a second connection pad connected to the second via conductor.

Patent Agency Ranking