公开(公告)号：US20180342445A1

公开(公告)日：2018-11-29

申请号：US15896029

申请日：2018-02-13

Applicant: PROTEC CO., LTD.

Inventor： MOO SUP SHIM ,  SEONG YONG JI ,  HYOUNG YEON JU ,  CHIHO CHO

IPC: H01L23/495 ,  B23K3/08 ,  H01L23/00 ,  H05K3/34 ,  H01L23/498 ,  H05K13/00

Abstract: An apparatus for bonding a flexible part including inclined leads is provided, more particularly, an apparatus for bonding a flexible part including inclined leads, which aligns parts to bond the parts is provided. According to the apparatus for bonding a flexible part including inclined leads, an electronic part may be easily bonded to a part having an inclined surface.

公开(公告)号：US20190001426A1

公开(公告)日：2019-01-03

申请号：US15896025

申请日：2018-02-13

Applicant: PROTEC CO., LTD.

Inventor： MOO SUP SHIM ,  SEONG YONG JI ,  HYOUNG YEON JU ,  CHIHO CHO

IPC: B23K3/06 ,  B23K3/08 ,  B23K1/00 ,  H05K3/34 ,  H01L23/00

CPC classification number: B23K3/0623 ,  B23K1/0016 ,  B23K3/087 ,  B23K2101/36 ,  H01L24/741 ,  H05K3/3426 ,  H05K2201/10757 ,  H05K2203/041

Abstract: A method of bonding a flexible part including inclined leads is provided, and more particularly, a method of bonding a flexible part including inclined leads, in which parts are aligned to bond the parts is provided. According to the method of bonding the flexible part including inclined leads, an electronic part may be easily bonded to a part having an inclined surface.