Abstract:
A method provides a circuit carrier arrangement that includes: a cooling plate (1) which has spacer and fastening elements (3) for connection to a printed circuit board (2) in a spaced-apart manner; a printed circuit board (2) which has bores (4) for receiving spring element sleeves (9); at least one power semiconductor component (10) which is connected by a soldered connection to the printed circuit board (2) and fastening elements (3) in the state in which it is fitted with the cooling plate (1) by means of plug-in connections (11) of spring-action configuration; and at least one spring element (5) having at least two spring element sleeves (9) between which a web (6) that is connected to the spring element sleeves (9) extends, and supporting elements (7) arranged on either side of said web and at least one spring plate (8) being arranged on said web.
Abstract:
A method of bonding a flexible part including inclined leads is provided, and more particularly, a method of bonding a flexible part including inclined leads, in which parts are aligned to bond the parts is provided. According to the method of bonding the flexible part including inclined leads, an electronic part may be easily bonded to a part having an inclined surface.
Abstract:
Disclosed is wiring substrate, the wiring substrate including a substrate having a high thermal conductive layer, in which at least one of a front surface and a rear surface of the substrate is a mounting surface for a variety of components; a window section formed in the substrate; and a connection terminal extended from an inside surface portion of the window section and bending in a direction perpendicular to a surface of the substrate.
Abstract:
A multilayer ceramic component including a multilayer ceramic capacitor including first and second external electrodes disposed on a mounting surface of a ceramic body; and first and second terminal electrodes each including an upper horizontal part disposed on a lower surface of the respective external electrode, a lower horizontal part disposed below the upper horizontal part and spaced apart from the upper horizontal part, and a connecting part connecting the upper horizontal part and the lower horizontal part, the connecting part having a plurality of openings alternately facing opposite end surfaces of the ceramic body.
Abstract:
A conical inductor provided in the present invention includes: a housing, a conical coil located inside the housing, a first pin and a second pin respectively connected to two ends of the conical coil, where one end of the first pin is connected to one end of the conical coil, the other end of the first pin is connected to a hole in a first side wall of the housing in a fastened manner, one end of the second pin is connected to the other end of the conical inductor, and the other end of the second pin is connected to a hole in a second side wall of the housing in a fastened manner; and each of the first pin and the second pin includes one segment of waveform segment fluctuating in a direction perpendicular to a top wall of the housing.
Abstract:
An electric connector, a plug-in module thereof and a production method of the plug-in module are provided. The plug-in module comprises a base, an input unit, an output unit and an output end. The base comprises a top plate, a bottom plate and one connection plate. A plurality of input terminals and a plurality of intermediate terminals are fixed to the base. The input unit comprises one input circuit board provided vertically to the base and electrically coupled to an end portion of the input terminals. At least one channel are provided on the input circuit board. Each channel comprises a transformer electrically coupled to the input circuit board. The output unit comprises an output circuit board horizontally provided to the base and electrically coupled to the input circuit board via the intermediate terminals. The output end are fixed to and electrically coupled to the output circuit board.
Abstract:
An assembly provides a dual function for mounting a port connector on a circuit board and also secures a capacitor to the circuit board. The assembly includes the circuit board and a monolithic plastic frame having a flange, a snap structure, a capacitor cradle, and a socket section. The flange has a fastening structure for fastening the frame to the circuit board. The snap structure for a snap-in attachment of the port connector to the frame is arranged near an end edge of the circuit board. The capacitor cradle for holding a cylindrical capacitor is formed adjacent to the snap structure and is elevated from the circuit board by an air gap. The socket section bears socket contacts for receiving capacitor contact leads.
Abstract:
A printed circuit board mounted with a power module having both a plurality of lead terminals for soldering and at least one screw terminal for screwing includes a through hole which receives the lead terminal and is soldered to the lead terminal, and an electrode section provided with a screw hole fastened to the screw terminal via a screw. A groove is formed between the electrode section and the through hole so as to intersect with two common tangents each connecting, to an outer periphery of a land of the through hole, an outer periphery of a contact area of the electrode section which is in contact with a head bearing surface of a screw or a washer.
Abstract:
Disclosed is wiring substrate, the wiring substrate including a substrate having a high thermal conductive layer, in which at least one of a front surface and a rear surface of the substrate is a mounting surface for a variety of components; a window section formed in the substrate; and a connection terminal extended from an inside surface portion of the window section and bending in a direction perpendicular to a surface of the substrate.
Abstract:
An automotive component assembly comprises an input circuit portion for a sensor and a component portion. The input circuit portion is aligned with the component portion in a desired assembly position. A pocket is at least partially defined by the component portion to receive the input circuit portion and a clamping force retains the input circuit portion between a first layer and a second layer of the component portion forming the pocket. An overmold material is applied to retain the input circuit portion and the component portion to one another.