公开(公告)号：US20200260585A1

公开(公告)日：2020-08-13

申请号：US16865120

申请日：2020-05-01

申请人： Pulse Electronics, Inc.

发明人： Thuyen DINH ,  Mohammad Saboori ,  Aurelio Gutierrez ,  Thomas Rascon

IPC分类号： H05K1/18 ,  H01F27/29 ,  H01F27/28 ,  H01F41/10 ,  H01F27/30

摘要： Methods and apparatus for providing enhanced coupled inductive devices. In one embodiment, an inductive device is disclosed that is suitable in Ethernet applications with data speeds exceeding one (1) Gbps. Specifically, the inductive devices described herein possess a high level of magnetic and capacitive coupling between the wires of the windings. Moreover, the inductive devices described herein are suitable for automated processes, thereby reducing the overall costs associated with their manufacture and use. Furthermore, methods for manufacturing and using these aforementioned inductive devices are also disclosed. For example, the aforementioned inductive devices may readily be incorporated into ICMs thereby replacing, in their entirety or in part, manually wound toroidal transformers.

公开(公告)号：US20180269633A1

公开(公告)日：2018-09-20

申请号：US15920224

申请日：2018-03-13

申请人： Pulse Electronics, Inc.

发明人： Thomas Rascon ,  Thuyen Dinh ,  Mohammad Saboori

IPC分类号： H01R13/6587 ,  H01R12/72

CPC分类号： H01R13/6587 ,  H01R12/721 ,  H01R12/724 ,  H01R13/6633 ,  H01R13/7175 ,  H01R24/64

摘要： An integrated connector module (ICM) is disclosed. In one embodiment, the ICM includes a plurality of shielding components, the plurality of shielding components comprising a port to port shield, an insert to insert shield and a main body shield. The ICM also contains one or more housing components, the one or more housing components comprising a plurality of ports that are arranged so as to be offset from a main signal conditioning portion of the one or more housing components; and an electronics assembly disposed within the one or more housing components. Methods and apparatus for utilizing and manufacturing the aforementioned ICM are also disclosed.

公开(公告)号：US20150206646A1

公开(公告)日：2015-07-23

申请号：US14550739

申请日：2014-11-21

申请人： Pulse Electronics, Inc.

发明人： Thuyen Dinh ,  Mohammad Saboori ,  Aurelio Gutierrez ,  Collin Kneifl ,  Thomas Rascon ,  Farid Hamidy

IPC分类号： H01F27/28

CPC分类号： H01F17/045 ,  H01F41/07 ,  H01F2017/0093

摘要： Improved balance winding of electronic components including common-mode chokes and methods for using and manufacturing the same. In one embodiment, the common-mode choke includes a core and a pair of windings. The first winding and the second winding are alternatingly wound around the core with each respective winding being flipped at least once over the traverse direction of the winding barrel of the core. In one variant, the number of flips is dependent upon the core geometry, number of windings, and/or the specification limits on electrical balance. In another variant, the windings are first twisted and/or braided prior to being wound onto the winding barrel of the core.

摘要翻译： 包括共模扼流圈在内的电子元件的平衡绕组改进，以及使用和制造它们的方法。 在一个实施例中，共模扼流圈包括芯和一对绕组。 第一绕组和第二绕组交替地缠绕在芯上，每个相应的绕组在芯的绕组筒的横向方向上至少翻转一次。 在一个变型中，翻转次数取决于磁芯几何形状，绕组数量和/或电气平衡上的规格限制。 在另一个变型中，绕组首先被扭曲和/或编织，然后被缠绕到芯的绕组筒上。

公开(公告)号：US20200013534A1

公开(公告)日：2020-01-09

申请号：US16518874

申请日：2019-07-22

申请人： Pulse Electronics, Inc.

发明人： Thuyen Dinh ,  Mohammad Saboori ,  Aurelio Gutierrez ,  Collin Kneifl ,  Thomas Rascon ,  Farid Hamidy

IPC分类号： H01F17/04

摘要： Improved balance winding of electronic components including common-mode chokes and methods for using and manufacturing the same. In one embodiment, the common-mode choke includes a core and a pair of windings. The first winding and the second winding are alternatingly wound around the core with each respective winding being flipped at least once over the traverse direction of the winding barrel of the core. In one variant, the number of flips is dependent upon the core geometry, number of windings, and/or the specification limits on electrical balance. In another variant, the windings are first twisted and/or braided prior to being wound onto the winding barrel of the core.

公开(公告)号：US11991829B2

公开(公告)日：2024-05-21

申请号：US16865120

申请日：2020-05-01

申请人： Pulse Electronics, Inc.

发明人： Thuyen Dinh ,  Mohammad Saboori ,  Aurelio Gutierrez ,  Thomas Rascon

IPC分类号： H01F27/28 ,  H01F27/29 ,  H01F27/30 ,  H01F41/04 ,  H01F41/10 ,  H05K1/18

CPC分类号： H05K1/18 ,  H01F27/2823 ,  H01F27/2828 ,  H01F27/292 ,  H01F27/306 ,  H01F41/04 ,  H01F41/10

摘要： Methods and apparatus for providing enhanced coupled inductive devices. In one embodiment, an inductive device is disclosed that is suitable in Ethernet applications with data speeds exceeding one (1) Gbps. Specifically, the inductive devices described herein possess a high level of magnetic and capacitive coupling between the wires of the windings. Moreover, the inductive devices described herein are suitable for automated processes, thereby reducing the overall costs associated with their manufacture and use. Furthermore, methods for manufacturing and using these aforementioned inductive devices are also disclosed. For example, the aforementioned inductive devices may readily be incorporated into ICMs thereby replacing, in their entirety or in part, manually wound toroidal transformers.

公开(公告)号：US20130288526A1

公开(公告)日：2013-10-31

申请号：US13797527

申请日：2013-03-12

申请人： PULSE ELECTRONICS, INC.

发明人： Thomas Rascon ,  Mohammad Saboori

IPC分类号： H01R13/6581

CPC分类号： H01R13/6581 ,  H01R13/514 ,  H01R13/6586 ,  H01R13/6658

摘要： High electrical isolation connector apparatus and methods. In one embodiment, an integrated connector module (ICM) is disclosed. The ICM includes a number of adjacent electronic subassemblies that are shielded through the use of an insert body shield. The insert body shield beneficially increases electrical isolation between adjacent subassemblies thereby further mitigating possible electrical noise. The insert body shield is configured to be received within a slot formed within the connector housing. An internal shield is also included that is received in a slot of an insert body of the electronic sub-assemblies, thereby effectively shielding adjacent component receiving cavities from one another. Methods and apparatus are also disclosed which make use and take advantage of these shielded ICMs. For example, telecommunications/networking equipment that incorporates these ICMs are also disclosed.

摘要翻译： 高电隔离连接器的设备和方法。 在一个实施例中，公开了集成连接器模块（ICM）。 ICM包括通过使用插入体屏蔽而被屏蔽的多个相邻的电子组件。 插入体屏蔽有利地增加相邻子组件之间的电隔离，从而进一步减轻可能的电噪声。 插入体屏蔽被配置为容纳在形成在连接器壳体内的槽内。 还包括内部屏蔽件，其被接收在电子子组件的插入体的狭槽中，从而有效地将相邻的部件容纳腔彼此屏蔽。 还公开了利用和利用这些屏蔽ICM的方法和装置。 例如，还公开了并入这些ICM的电信/网络设备。

公开(公告)号：US20170004919A1

公开(公告)日：2017-01-05

申请号：US15199407

申请日：2016-06-30

申请人： Pulse Electronics, Inc.

发明人： Thuyen Dinh ,  Mohammad Saboori ,  Aurelio Gutierrez ,  Thomas Rascon

IPC分类号： H01F27/29 ,  H05K1/18 ,  H01F41/06 ,  H01F27/28

CPC分类号： H05K1/18 ,  H01F27/2823 ,  H01F27/2828 ,  H01F27/292 ,  H01F27/306 ,  H01F41/10

摘要： Methods and apparatus for providing enhanced coupled inductive devices. In one embodiment, an inductive device is disclosed that is suitable in Ethernet applications with data speeds exceeding one (1) Gbps. Specifically, the inductive devices described herein possess a high level of magnetic and capacitive coupling between the wires of the windings. Moreover, the inductive devices described herein are suitable for automated processes, thereby reducing the overall costs associated with their manufacture and use. Furthermore, methods for manufacturing and using these aforementioned inductive devices are also disclosed. For example, the aforementioned inductive devices may readily be incorporated into ICMs thereby replacing, in their entirety or in part, manually wound toroidal transformers.

摘要翻译： 用于提供增强耦合感应装置的方法和装置。 在一个实施例中，公开了适用于数据速度超过一（1）Gbps的以太网应用的感应装置。 具体地说，这里描述的电感器件在绕组的电线之间具有高水平的磁性和电容耦合。 此外，本文所述的感应装置适用于自动化过程，从而降低与其制造和使用相关联的整体成本。 此外，还公开了用于制造和使用这些上述感应装置的方法。 例如，上述感应装置可容易地并入到ICM中，从而全部或部分地替代手动绕制的环形变压器。

公开(公告)号：US09178318B2

公开(公告)日：2015-11-03

申请号：US13797527

申请日：2013-03-12

申请人： PULSE ELECTRONICS, INC.

发明人： Thomas Rascon ,  Mohammad Saboori

IPC分类号： H01R13/648 ,  H01R13/6581 ,  H01R13/6586 ,  H01R13/514 ,  H01R13/66

CPC分类号： H01R13/6581 ,  H01R13/514 ,  H01R13/6586 ,  H01R13/6658

摘要： High electrical isolation connector apparatus and methods. In one embodiment, an integrated connector module (ICM) is disclosed. The ICM includes a number of adjacent electronic subassemblies that are shielded through the use of an insert body shield. The insert body shield beneficially increases electrical isolation between adjacent subassemblies thereby further mitigating possible electrical noise. The insert body shield is configured to be received within a slot formed within the connector housing. An internal shield is also included that is received in a slot of an insert body of the electronic sub-assemblies, thereby effectively shielding adjacent component receiving cavities from one another. Methods and apparatus are also disclosed which make use and take advantage of these shielded ICMs. For example, telecommunications/networking equipment that incorporates these ICMs are also disclosed.

摘要翻译： 高电隔离连接器的设备和方法。 在一个实施例中，公开了集成连接器模块（ICM）。 ICM包括通过使用插入体屏蔽而被屏蔽的多个相邻的电子组件。 插入体屏蔽有利地增加相邻子组件之间的电隔离，从而进一步减轻可能的电噪声。 插入体屏蔽被配置为容纳在形成在连接器壳体内的槽内。 还包括内部屏蔽件，其被接收在电子子组件的插入体的狭槽中，从而有效地将相邻的部件容纳腔彼此屏蔽。 还公开了利用和利用这些屏蔽ICM的方法和装置。 例如，还公开了并入这些ICM的电信/网络设备。