公开(公告)号：US20170346195A1

公开(公告)日：2017-11-30

申请号：US15603062

申请日：2017-05-23

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： CHIE YAMAMOTO ,  HIDEKI IWAKI ,  RYOSUKE SHIOZAKI

IPC: H01Q21/22 ,  H01Q1/38 ,  H01Q3/34 ,  H01Q9/04

CPC classification number: H01Q21/22 ,  H01P5/028 ,  H01Q1/3233 ,  H01Q1/38 ,  H01Q3/34 ,  H01Q9/045 ,  H01Q9/0457 ,  H01Q11/04 ,  H01Q21/0075 ,  H01Q21/0093 ,  H01Q21/065 ,  H01Q21/08 ,  H05K1/0222 ,  H05K1/0243 ,  H05K1/0251 ,  H05K1/0373 ,  H05K3/4626

Abstract: An antenna module includes a multilayer board, a phased array antenna that includes antenna elements arranged on an outer face of a second conductor layer included in the multilayer board and adjusts one or more beam directions of the antenna elements, a radio frequency (RF) chip that is arranged on an outer face of first conductor layers included in the multilayer board and outputs the radio frequency signal, a matching circuit that is arranged on the outer face of the first conductor layers and adjusts matching between impedance of the antenna elements and impedance of the RF chip, a through hole that couples the first conductor layers and the second conductor layer, and one or more vias that are on an outer side in a diameter direction of the through hole and couples the first conductor layers.