公开(公告)号：US10244657B2

公开(公告)日：2019-03-26

申请号：US15023418

申请日：2014-09-01

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Masafumi Nakayama ,  Yoshiya Sakaguchi ,  Hirofumi Yamada

IPC: H05K7/20 ,  H05K5/02 ,  H01L23/427

Abstract: A thermal insulation sheet includes a heat storage sheet, an insulation sheet affixed to the heat storage sheet, and a highly-thermoconductive sheet affixed to the insulation sheet. The heat storage sheet contains a resin and powdery microcapsules mixed with the resin. The powdery microcapsules encapsulate latent-heat storage agent. The heat storage sheet has a void ratio not less than 10% and not more than 30%. Or, the heat storage sheet may have surface roughness Ra not less than 2 μm and not more than 20 μm. The thermal insulation sheet suppresses or retards transferring of heat generated in a heat-generating component to outside, and suppresses a rapid rising of a temperature of the heat-generating component.

公开(公告)号：US10438866B2

公开(公告)日：2019-10-08

申请号：US14778138

申请日：2014-01-08

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Masafumi Nakayama ,  Yoshiya Sakaguchi ,  Hirofumi Yamada

IPC: B32B27/40 ,  B32B37/06 ,  B32B37/24 ,  B32B5/16 ,  B32B7/12 ,  F16L59/02 ,  H01L23/427 ,  B32B9/04 ,  B32B27/28 ,  B32B33/00 ,  B32B9/00 ,  B32B15/09 ,  B32B15/20 ,  B32B27/14 ,  B32B27/16 ,  B32B27/36 ,  B32B37/14

Abstract: A heat-insulating sheet includes a heat storage sheet, a first insulating sheet, and a thermally conductive sheet. The heat storage sheet contains a first resin and a plurality of microcapsules containing latent heat storage material and mixed in the form of aggregates with each other. The first insulating sheet has a first face bonded to the heat storage sheet and a second face opposite to the first face. The thermally conductive sheet is bonded to the second face of the first insulating sheet. The content of the microcapsules in the heat storage sheet is falls within a range from 40 wt % to 90 wt %, inclusive. The heat storage sheet includes a layer free from the microcapsules at a portion in contact with the first insulating sheet.

公开(公告)号：US11720211B2

公开(公告)日：2023-08-08

申请号：US17776156

申请日：2020-10-30

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Yuji Nonami ,  Hirofumi Yamada ,  Tetsuya Minamide ,  Shigeyuki Fujii

IPC: G06F3/044

CPC classification number: G06F3/044

Abstract: A touch sensor includes a substrate with a first surface, and a plurality of first electrodes on the first surface of the substrate in a view area. The first surface of the substrate includes a plurality of bottomed grooves extending linearly. Each first electrode includes a plurality of fine lines including a conductive material buried in one of the grooves. Each fine line includes a bottomed recess recessed from the first surface toward the bottom surface of each groove.