公开(公告)号：US10689556B2

公开(公告)日：2020-06-23

申请号：US15575464

申请日：2016-05-20

Applicant: POLYMATECH JAPAN CO., LTD. ,  PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Yasuyoshi Watanabe ,  Yoshiya Sakaguchi ,  Masafumi Nakayama

IPC: B32B9/00 ,  C09K5/14 ,  C08L83/04 ,  C08K3/013 ,  H01L23/373 ,  H01L23/42 ,  C08K3/04 ,  B32B7/02 ,  B32B27/08 ,  B32B27/20 ,  B32B27/28 ,  C08K7/00 ,  C08G77/20 ,  C08K7/02 ,  C08G77/12 ,  B82Y30/00

Abstract: Provided is a thermally conductive sheet including an oriented-graphite thermally conductive layer and an insulating thermally conductive layer stacked on the oriented-graphite thermally conductive layer, the oriented-graphite thermally conductive layer including a polymer matrix including a plate-like graphite powder, flat surfaces of particles of the plate-like graphite powder being oriented in the thickness direction of the sheet, the insulating thermally conductive layer including a polymer matrix including an insulating thermally conductive filler dispersed in the polymer matrix, the insulating thermally conductive layer having a thermal conductivity and an insulating property. The thermally conductive sheet has a high thermal conductivity and an insulating property, is capable of being readily fixed to an adherend, and is easy to handle.

公开(公告)号：US10244657B2

公开(公告)日：2019-03-26

申请号：US15023418

申请日：2014-09-01

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Masafumi Nakayama ,  Yoshiya Sakaguchi ,  Hirofumi Yamada

IPC: H05K7/20 ,  H05K5/02 ,  H01L23/427

Abstract: A thermal insulation sheet includes a heat storage sheet, an insulation sheet affixed to the heat storage sheet, and a highly-thermoconductive sheet affixed to the insulation sheet. The heat storage sheet contains a resin and powdery microcapsules mixed with the resin. The powdery microcapsules encapsulate latent-heat storage agent. The heat storage sheet has a void ratio not less than 10% and not more than 30%. Or, the heat storage sheet may have surface roughness Ra not less than 2 μm and not more than 20 μm. The thermal insulation sheet suppresses or retards transferring of heat generated in a heat-generating component to outside, and suppresses a rapid rising of a temperature of the heat-generating component.

公开(公告)号：US20170345734A1

公开(公告)日：2017-11-30

申请号：US15536222

申请日：2015-12-01

Applicant: POLYMATECH JAPAN CO., LTD. ,  PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Yasuyoshi Watanabe ,  Yoshiya Sakaguchi ,  Masafumi Nakayama

IPC: H01L23/373 ,  H05K7/20 ,  C08K3/04 ,  C09K5/14

CPC classification number: H01L23/3733 ,  C08K3/04 ,  C08K3/22 ,  C08K2003/2227 ,  C08K2201/001 ,  C08K2201/005 ,  C08K2201/006 ,  C09K5/14 ,  H01L23/373 ,  H01L23/3737 ,  H01L23/42 ,  H01L2924/0002 ,  H05K7/2039 ,  H01L2924/00 ,  C08L83/04

Abstract: The thermally conductive sheet includes a sheet-like formed body produced by curing a mixed composition containing an uncured polymer matrix, a flat graphite powder, and a thermally conductive filler having an aspect ratio of 2 or less, flat surfaces of particles of the flat graphite powder being aligned in a thickness direction of the sheet. The thermally conductive sheet contains the thermally conductive filler together with the flat graphite powder and thus contains the thermally conductive material densely charged and has good flexibility and good tackiness on the surfaces of the sheet.

公开(公告)号：US10438866B2

公开(公告)日：2019-10-08

申请号：US14778138

申请日：2014-01-08

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Masafumi Nakayama ,  Yoshiya Sakaguchi ,  Hirofumi Yamada

IPC: B32B27/40 ,  B32B37/06 ,  B32B37/24 ,  B32B5/16 ,  B32B7/12 ,  F16L59/02 ,  H01L23/427 ,  B32B9/04 ,  B32B27/28 ,  B32B33/00 ,  B32B9/00 ,  B32B15/09 ,  B32B15/20 ,  B32B27/14 ,  B32B27/16 ,  B32B27/36 ,  B32B37/14

Abstract: A heat-insulating sheet includes a heat storage sheet, a first insulating sheet, and a thermally conductive sheet. The heat storage sheet contains a first resin and a plurality of microcapsules containing latent heat storage material and mixed in the form of aggregates with each other. The first insulating sheet has a first face bonded to the heat storage sheet and a second face opposite to the first face. The thermally conductive sheet is bonded to the second face of the first insulating sheet. The content of the microcapsules in the heat storage sheet is falls within a range from 40 wt % to 90 wt %, inclusive. The heat storage sheet includes a layer free from the microcapsules at a portion in contact with the first insulating sheet.

公开(公告)号：US10091868B2

公开(公告)日：2018-10-02

申请号：US15325526

申请日：2015-09-09

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Masafumi Nakayama ,  Koji Matsuno

IPC: H05K1/00 ,  H05K1/02 ,  H05K1/18 ,  F28F21/06 ,  F28F3/12 ,  F28F13/18

Abstract: A heat-dissipating sheet includes a thermally-conductive resin sheet, an adhesive layer on an upper surface of the thermally-conductive resin sheet, and a thermally-conductive film on an upper surface of the adhesive layer. The thermally-conductive film has a higher thermal conductivity than the thermally-conductive resin sheet. The thermally-conductive resin sheet has a thin portion that is locally thin to form a recess in a lower surface of the thermally-conductive resin sheet. The recess may be an aperture passing through the thermally-conductive resin sheet. The adhesive layer is exposed from the aperture.