Electronic component mounting method

    公开(公告)号:US09999170B2

    公开(公告)日:2018-06-12

    申请号:US14629664

    申请日:2015-02-24

    CPC classification number: H05K13/0434 H05K13/021 Y10T29/4913 Y10T29/53174

    Abstract: Electronic component mounting method for mounting an electronic component on a plurality of board types includes: placing, on tray holding shelves, trays storing components for first and second board types, respectively; recognizing on which tray holding shelf the tray is placed by reading identification information from the trays. The method further includes: rearranging the trays in the tray feeder to a first tray arrangement adapted for the first board type, based on recognized placement position of the tray and the first tray arrangement data, before start of production of the board of the first board type; and rearranging the trays in the tray feeder to a second tray arrangement adapted for the second board type, based on the second tray arrangement data, before start of production of the board of the second board type.

    Preparation operation determination system, method, and apparatus

    公开(公告)号:US10775775B2

    公开(公告)日:2020-09-15

    申请号:US16106224

    申请日:2018-08-21

    Abstract: A production system includes a production line for producing a product by connecting a plurality of production facilities having working units for doing work on a transported workpiece; a gap time calculator that calculates a plurality of gap times respectively corresponding to the plurality of the production facilities until a next workpiece is transported from an upstream production facility to each of the plurality of the production facilities based on a production status of each of the plurality of the production facilities; and a preparation operation determination unit that determines an automatic preparation operation capable of being executed in each of the plurality of the production facilities based on the plurality of the gap times. Each of the plurality of the production facilities executes the determined automatic preparation operation.

    Component mounting method and component mounting system

    公开(公告)号:US10149420B2

    公开(公告)日:2018-12-04

    申请号:US14794368

    申请日:2015-07-08

    Abstract: A component mounting method is provided in a component mounting apparatus that mounts a component onto a board using a plurality of pieces of production data linked to component data. The method includes executing, when the component data is changed, a simulation of a production cycle time based on the production data, and comparing a simulation result of the production cycle time after change of the component data with a production cycle time or a simulation result of the production cycle time before change of the component data, and outputting a comparison result.

    Component arrangement determination method

    公开(公告)号:US09997502B2

    公开(公告)日:2018-06-12

    申请号:US14799766

    申请日:2015-07-15

    Abstract: There is provided a component arrangement determination method, in a component mounting apparatus including a plurality of component supply units for supplying components, for determining arrangement of the component supply units used for production of a plurality of types of component mounted boards. The method includes specifying a production frequency of each of the plurality of types of component mounted boards for a predetermined period of time, grouping the plurality of types of component mounted boards into a plurality of groups capable of being produced without changing the arrangement of the component supply units based on the production frequency, and determining arrangement, in the component mounting apparatus, of the component supply units for supplying components necessary for production of types of component mounted boards that belong to each group of the plurality of groups.

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