公开(公告)号：US20230085242A1

公开(公告)日：2023-03-16

申请号：US17801747

申请日：2021-02-05

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Keiichi KOMATSU ,  Hiroshi YAMAMOTO

IPC: C09K5/14 ,  C08G77/04 ,  C08K7/00 ,  H05K7/20

Abstract: A thermally conductive silicone composition contains a silicone component (A) and a polyhedral alumina filler (B) having a gelatinization ratio equal to or higher than 80%.

公开(公告)号：US20220363836A1

公开(公告)日：2022-11-17

申请号：US17772018

申请日：2020-10-30

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Hiroshi YAMAMOTO ,  Keiichi KOMATSU

IPC: C08G77/04 ,  C08K3/22 ,  H01L23/373

Abstract: A thermally conductive silicone composition contains a silicone component (A) and a tetradecahedral filler (B1).

公开(公告)号：US20240228855A9

公开(公告)日：2024-07-11

申请号：US18548316

申请日：2022-03-09

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Keiichi KOMATSU ,  Asahi KASUE ,  Atsushi YAMAGUCHI

IPC: C09K5/14 ,  C08K3/22 ,  C08L63/00

CPC classification number: C09K5/14 ,  C08K3/22 ,  C08L63/00 ,  C08K2003/2227 ,  C08K2201/001 ,  C08L2207/02

Abstract: A thermally conductive resin composition includes a first resin phase, a second resin phase, and a thermally conductive filler. The first resin phase and the second resin phase are phase-separated. The thermally conductive filler in the first resin phase has a density higher than a density of the thermally conductive filler in the second resin phase.

公开(公告)号：US20240132767A1

公开(公告)日：2024-04-25

申请号：US18548316

申请日：2022-03-09

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Keiichi KOMATSU ,  Asahi KASUE ,  Atsushi YAMAGUCHI

IPC: C09K5/14 ,  C08K3/22 ,  C08L63/00

CPC classification number: C09K5/14 ,  C08K3/22 ,  C08L63/00 ,  C08K2003/2227 ,  C08K2201/001 ,  C08L2207/02

Abstract: A thermally conductive resin composition includes a first resin phase, a second resin phase, and a thermally conductive filler. The first resin phase and the second resin phase are phase-separated. The thermally conductive filler in the first resin phase has a density higher than a density of the thermally conductive filler in the second resin phase.

公开(公告)号：US20220306863A1

公开(公告)日：2022-09-29

申请号：US17640157

申请日：2020-08-20

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Keiichi KOMATSU ,  Hiroshi YAMAMOTO

IPC: C08L83/04

Abstract: A thermally conductive silicone composition contains a silicone component and a polyhedral filler.