公开(公告)号：US20160060808A1

公开(公告)日：2016-03-03

申请号：US14820518

申请日：2015-08-06

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： KAZUMA OIKAWA ,  KEI TOYOTA ,  SHIGEAKI SAKATANI ,  MASANORI MORITA ,  KENJI KONDO ,  DAIDO KOHMYOHJI

IPC: D06M15/643 ,  D06M10/10

CPC classification number: D06M15/643 ,  D06M10/10 ,  D06M13/513 ,  D06M2101/22 ,  D06M2101/32 ,  D06M2200/30 ,  D06M2400/01 ,  D06M2400/02

Abstract: A heat insulation sheet includes, as a substrate, a silica aerogel with low heat conductivity and high mechanical strength In a hydrophobization reaction of a hydrogel, a silane coupling agent having a reactive organic functional group is used to conduct hydrophobization, and, after volatilization of a solvent in a drying step, the temperature is elevated to 100° C. or higher that is a reaction-starting temperature, thereby reacting and bonding the reactive functional group and a fiber to each other. This allows prevention of detachment or loss of fine particles of silica xerogel from the unwoven fabric fiber.

Abstract translation: 隔热片包括作为基底的具有低导热性和高机械强度的二氧化硅气凝胶。在水凝胶的疏水化反应中，使用具有反应性有机官能团的硅烷偶联剂进行疏水化，并且在挥发后 在干燥步骤中的溶剂中，将温度升高至反应开始温度为100℃以上，从而使反应性官能团和纤维彼此反应并键合。 这样可以防止无纺布纤维从二氧化硅干凝胶中分离或损失细颗粒。

公开(公告)号：US20170194829A1

公开(公告)日：2017-07-06

申请号：US15325514

申请日：2015-07-29

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： YUICHIRO SADANAGA ,  KENJI KONDO ,  TAKESHI SAKATA ,  MASANORI MORITA

IPC: H02K5/08 ,  H02K11/33 ,  B29C69/02 ,  F16L59/02

Abstract: A thermal insulation structure for an electronic device of the present invention is a thermal insulation structure which thermally insulates between an electronic circuit unit and a heat generator formed with another component. In the thermal insulation structure, a partition wall for separating each space and formed of resin having electric insulation properties is provided between the electronic circuit unit and the heat generator. Also, the partition wall is formed by integrating the resin and a thermal insulation material having thermal conductivity lower than thermal conductivity of air so that the resin includes the thermal insulation material. Further, the partition wall is formed by insert-molding the thermal insulation material with the resin. Further, the resin having the electric insulation properties is thermoplastic resin, and a thermal insulation raw material of the thermal insulation material is silica xerogel.