Microelement
    2.
    发明授权

    公开(公告)号:US09914116B2

    公开(公告)日:2018-03-13

    申请号:US15208795

    申请日:2016-07-13

    Abstract: A microelement includes: a base being a body of the microelement, the base including a liquid inlet for a liquid to be introduced, a liquid outlet for the liquid to be discharged, and a groove for the liquid to flow from the liquid inlet toward the liquid outlet; a cover that covers the groove of the base; and a liquid flow controller film segment that is fixed to an inner surface of the cover so as to be opposite to the groove. The liquid flow controller film segment is arc-shaped curved-band-like extending in a direction crossing a flow direction of the liquid and has a radius about a center-corresponding position of the cover corresponding to a center of the liquid outlet of the groove. The liquid flow controller film segment is exposed in the groove and disposed on the downstream side to an exposed surface at the inner surface of the cover in the flow direction of the liquid in the groove. The liquid flow controller film segment has a contact angle that is greater than a contact angle of the exposed surface at the inner surface of the cover.

    Cooling device, projector, and heat receiving unit

    公开(公告)号:US10698304B2

    公开(公告)日:2020-06-30

    申请号:US16195196

    申请日:2018-11-19

    Abstract: A cooling device includes a heat receiving unit, a working fluid, a radiator, and a pump. The heat receiving unit includes a first member, a second member, an inlet housing, and an outlet housing. The first member receives heat. The second member is disposed to face the first member. The inlet housing is connected to the pump and disposed between the first member and the second member. The outlet housing is connected to the radiator and disposed on a side of the second member facing away from the inlet housing. The first member and the second member are disposed at a predetermined distance away from each other. A vaporization space portion is disposed between the first member and the second member. An outlet space portion is disposed on a side of the second member facing away from the vaporization space portion.

    Imaging device
    4.
    发明授权
    Imaging device 有权
    成像设备

    公开(公告)号:US09357112B2

    公开(公告)日:2016-05-31

    申请号:US14594888

    申请日:2015-01-12

    CPC classification number: H04N5/2252 G03B17/02 H04N5/2253

    Abstract: An imaging device according to the present disclosure includes: an imaging unit that is housed in an outer case and captures an image of an object; a circuit board that is disposed on a back side in the outer case and includes a semiconductor device mounted thereon for processing a signal from the imaging unit; and a metal plate that is disposed between the imaging unit and the circuit board in the outer case and is fixed to the outer case. The metal plate has a first portion opposite to the circuit board and brought into mechanical contact with the semiconductor device through a contact member, and at least two second portions formed integrally with the first portion and bent in an optical axis direction of the imaging unit.

    Abstract translation: 根据本公开的成像装置包括:成像单元,其容纳在外壳中并且捕获物体的图像; 电路板,设置在外壳的背侧,并且包括安装在其上的半导体器件,用于处理来自成像单元的信号; 以及金属板,其设置在所述外壳中的所述摄像单元和所述电路基板之间并且固定到所述外壳。 金属板具有与电路板相对的第一部分,并且通过接触构件与半导体器件机械接触,并且至少两个第二部分与第一部分整体形成并沿着成像单元的光轴方向弯曲。

    Heat amount measuring method and heat amount measuring apparatus

    公开(公告)号:US11467040B2

    公开(公告)日:2022-10-11

    申请号:US16534176

    申请日:2019-08-07

    Abstract: A heat amount measuring method includes a first step of providing a heat-transferring component that transfers and receives heat to and from a heating component and measuring, while the heating component is generating heat, a first heat amount of heat transmitted from the heating component to the heat-transferring component, a first heating component temperature, and a first substrate temperature, a second step of changing an output of the heat-transferring component and measuring a second heat amount of heat transmitted from the heating component to the heat-transferring component, a second heating component temperature, and a second substrate temperature, and a third step of calculating a heat amount of heat transmitted from the heating component to a substrate by using the first heat amount, the first heating component temperature, the first substrate temperature, the second heat amount, the second heating component temperature, and the second substrate temperature.

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