公开(公告)号：US20200309636A1

公开(公告)日：2020-10-01

申请号：US16794432

申请日：2020-02-19

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Junya TANAKA ,  Taichi NAKAMURA ,  Masanori MINAMIO ,  Daido KOMYOJI

IPC: G01M7/02 ,  H02N2/18

Abstract: A state detection apparatus includes a state detection sensor that is attached to an architecture and that detects a state of the architecture, a power supp that generates power on the basis of vibration of the architecture, and a controller that controls the state detection sensor and the power supp. The controller supplies power to the state detection sensor to drive the state detection sensor in a case where a voltage by power generation exceeds a first threshold (threshold voltage), and acquires state information to be used for diagnosing the state of the architecture on the basis of a signal indicating a detection result received from the state detection sensor.

公开(公告)号：US20150235928A1

公开(公告)日：2015-08-20

申请号：US14682709

申请日：2015-04-09

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Masanori MINAMIO ,  Tatsuo SASAOKA

IPC: H01L23/495 ,  H01L23/29

CPC classification number: H01L23/49558 ,  H01L21/565 ,  H01L21/566 ,  H01L23/29 ,  H01L23/4334 ,  H01L23/49537 ,  H01L23/49562 ,  H01L23/49568 ,  H01L23/49575 ,  H01L23/49586 ,  H01L24/48 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: An encapsulated semiconductor device includes: a first conduction path formative plate; a second conduction path formative plate joined to the first conduction path formative plate; a power element bonded to the first conduction path formative plate; a heatsink held by the first conduction path formative plate with an insulation sheet interposed between the heatsink and the first conduction path formative plate; and an encapsulation resin configured to encapsulate the first and second conduction path formative plates. A through hole or a lead gap is formed in a region of the first conduction path formative plate in contact with the insulation sheet. The insulation sheet is press-fitted into the through hole or the lead gap.

Abstract translation: 封装的半导体器件包括：第一导电路径形成板; 连接到第一传导路径形成板的第二传导路径形成板; 功率元件，其结合到第一导电路径形成板; 由第一导电路径形成板保持的散热器，其间插入在散热器和第一传导路径形成板之间的绝缘片; 以及封装树脂，其被配置为封装所述第一和第二导电路径形成板。 在与绝缘片接触的第一导电路径成形板的区域中形成有通孔或引线间隙。 绝缘片被压配合到通孔或引线间隙中。