公开(公告)号：US20220252458A1

公开(公告)日：2022-08-11

申请号：US17437640

申请日：2020-02-17

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Ryota SUDO ,  Takanori SUGIYAMA ,  Takaaki HIRAMATSU ,  Nobuaki SHIMAMOTO ,  Hiroshi YAMANAKA ,  Naoki KOBAYASHI

IPC: G01J5/14 ,  G01J5/48

Abstract: A temperature sensing system senses a temperature in the monitor space. The temperature sensing system includes a first detector, a second detector, and a processing unit. The first detector detects a temperature on a ceiling and outputs first information about the temperature on the ceiling. The second detector detects infrared radiation emitted from a floor and outputs second information about the infrared radiation from the floor. The processing unit calculates, based on at least the first information and the second information, a spatial temperature distribution which includes a component in a height direction with respect to the monitor space between the ceiling and the floor.

公开(公告)号：US20220196481A1

公开(公告)日：2022-06-23

申请号：US17598862

申请日：2020-02-26

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Shoya KIDA ,  Nobuaki SHIMAMOTO ,  Nayuta MINAMI ,  Isao HATTORI ,  Naoki KOBAYASHI ,  Hiroshi YAMANAKA

IPC: G01J5/16 ,  G01J5/02

Abstract: A film structural component is supported by a substrate. The film structural component includes a plurality of thermal infrared detectors arranged in an array. Each of the plurality of thermal infrared detectors includes a thermopile having a plurality of hot junctions and a plurality of cold junctions. An infrared sensor further includes a plurality of heaters and at least one thermometer. The plurality of heaters are provided on the first principal surface of the substrate. The at least one thermometer is provided on the first principal surface of the substrate and is configured to detect a temperature of the substrate. Each of the plurality of heaters faces another heater of the plurality of heaters via a region including the plurality of thermal infrared detectors in plan view in the thickness direction of the substrate.

公开(公告)号：US20220408037A1

公开(公告)日：2022-12-22

申请号：US17777484

申请日：2020-09-16

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Ryota SUDO ,  Nayuta MINAMI ,  Nobuaki SHIMAMOTO ,  Naoki KOBAYASHI ,  Shoya KIDA

IPC: H04N5/351 ,  H04N5/33 ,  G06V40/10 ,  G01J5/00

Abstract: An infrared processing system includes a first thermal image generating unit, an object extracting unit, a second thermal image generating unit, and an object temperature calculating unit. The first thermal image generating unit generates, using a first temperature correction value, a first thermal image based on the output signal of the image sensor. The object extracting unit extracts the object from the first thermal image. The second thermal image generating unit generates, using a second temperature correction value corresponding to the object that has been extracted by the object extracting unit, a second thermal image based on the output signal of the image sensor. The object temperature calculating unit calculates, based on the second thermal image that has been generated by the second thermal image generating unit, a temperature of the object that has been extracted by the object extracting unit.