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公开(公告)号:US20220196481A1
公开(公告)日:2022-06-23
申请号:US17598862
申请日:2020-02-26
Inventor: Shoya KIDA , Nobuaki SHIMAMOTO , Nayuta MINAMI , Isao HATTORI , Naoki KOBAYASHI , Hiroshi YAMANAKA
Abstract: A film structural component is supported by a substrate. The film structural component includes a plurality of thermal infrared detectors arranged in an array. Each of the plurality of thermal infrared detectors includes a thermopile having a plurality of hot junctions and a plurality of cold junctions. An infrared sensor further includes a plurality of heaters and at least one thermometer. The plurality of heaters are provided on the first principal surface of the substrate. The at least one thermometer is provided on the first principal surface of the substrate and is configured to detect a temperature of the substrate. Each of the plurality of heaters faces another heater of the plurality of heaters via a region including the plurality of thermal infrared detectors in plan view in the thickness direction of the substrate.
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公开(公告)号:US20230204442A1
公开(公告)日:2023-06-29
申请号:US17919470
申请日:2021-02-08
Inventor: Takeshi MORI , Toshio YAMAZAKI , Isao HATTORI , Hirotsugu SUZUKI
Abstract: A sensor system includes a sensor element, a signal processing circuit, and a pseudo-signal correction circuit. The sensor element outputs an electric signal corresponding to an external force. The signal processing circuit converts the electric signal coming from the sensor element into a signal having a certain signal format and then outputs the signal thus converted. The pseudo-signal correction circuit corrects a pseudo-signal outputted by the sensor element. When receiving a test signal, the sensor element performs a self-diagnosis based on the test signal and then outputs the pseudo-signal, which represents a result of the self-diagnosis. The pseudo-signal correction circuit corrects the pseudo-signal based on environment information about an environment where at least one of the sensor element or the signal processing circuit is located.
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公开(公告)号:US20170356926A1
公开(公告)日:2017-12-14
申请号:US15667178
申请日:2017-08-02
Inventor: Isao HATTORI , Takeshi UEMURA , Satoshi OHUCHI , Yasunobu TSUKIO
IPC: G01P15/08 , G01C19/5776 , G01P15/135 , G01P15/18 , G01P15/03 , G01P15/125
CPC classification number: G01P15/08 , G01C19/5776 , G01P15/036 , G01P15/0802 , G01P15/125 , G01P15/135 , G01P15/18
Abstract: An inertial force sensor has a first sensor element, a second sensor element, a first signal processor, a second signal processor, and a power controller. The first sensor element converts a first inertial force to an electric signal, and the second sensor element converts a second inertial force to an electric signal. The first signal processor is connected to the first sensor element, and outputs a first inertial force value. The second signal processor is connected to the second sensor element, and outputs a second inertial force value. The power controller is connected to the first signal processor and the second signal processor, and changes power supplied to the second signal processor based on the first inertial force value.
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