公开(公告)号：US20200306893A1

公开(公告)日：2020-10-01

申请号：US16792654

申请日：2020-02-17

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： YASUHIRO SUZUKI ,  HIROHISA HINO ,  SHIGERU YAMATSU

IPC: B23K35/02 ,  B23K35/26

Abstract: Provided herein is a solder paste that can be used for solder connection requiring a high melting point, while, at the same time, ensuring excellent applicability, high adhesion, and excellent solder joint reliability. A mount structure mounting an electronic component with such a solder paste is also provided. The solder paste is a solder paste that includes a solder powder and a flux. The flux contains an epoxy resin, a phenolic resin, a benzooxazine compound, and an activating agent. The phenolic resin contains at least one type of phenolic resin having a phenolic hydroxyl group and an allyl group within the molecule.

公开(公告)号：US20190284442A1

公开(公告)日：2019-09-19

申请号：US16318429

申请日：2017-07-21

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： KAZUKI WATANABE ,  SHIGERU YAMATSU ,  NAOKI KANAGAWA ,  DAISUKE SASAKI

IPC: C09J7/35 ,  H01L23/29 ,  H01L23/31 ,  H01L23/498 ,  H01L23/00 ,  H01L21/78 ,  H01L21/48 ,  H01L21/56 ,  C09J4/06 ,  C09J5/06

Abstract: The acrylic composition for sealing contains an acrylic compound, a polyphenylene ether resin including a radical-polymerizable substituent at a terminal, an inorganic filler, a thermal radical polymerization initiator, and a thermoplastic resin.

公开(公告)号：US20180247910A1

公开(公告)日：2018-08-30

申请号：US15547965

申请日：2016-01-19

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： JIN JIN ,  NAOKI KANAGAWA ,  SHIGERU YAMATSU ,  DAISUKE SASAKI ,  KAZUKI WATANABE

IPC: H01L23/00 ,  C08K5/5435 ,  C08K5/14 ,  C08L33/08 ,  C08L33/10 ,  C08L63/00 ,  C08K3/22 ,  H01L21/48 ,  H01L21/50

Abstract: A sealing acrylic resin composition contains a thermosetting acrylic resin in liquid phase, an organic peroxide, and an inorganic filler in a content proportion ranging from 50% by mass to 95% by mass, inclusive. A silane coupling agent is bonded to the inorganic filler, a total organic carbon content of the inorganic filler in proportion being ranging from 0.1% by mass to 1.0% by mass, inclusive, in a state before the inorganic filler is mixed with at least one of the thermosetting acrylic resin and the organic peroxide. The silane coupling agent has an acrylic group.