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公开(公告)号：US10310084B2
公开(公告)日：2019-06-04
申请号：US15207365
申请日：2016-07-11
Inventor： Yoshihiko Murai , Shinji Yamamoto
Abstract: A range imaging apparatus includes a light illuminator that emits signal light from a light source toward a subject; a light receiver that receives light reflecting off the subject; a range image generator that calculates a distance value to the subject based on a time difference between emission and light reception, and generates a range image; a distance value distribution analyzer that calculates a distribution characteristic of the distance value calculated by the range image generator; an illumination controller that adjusts output of the light illuminator; an exposure controller that adjusts exposure by the light receiver; and a signal adjuster that adjusts the illumination controller and the exposure controller based on the distribution characteristic. The signal adjuster adjusts at least one of the illumination controller and the exposure controller for the second signal light based on the distribution characteristic obtained through emission and light reception of the first signal light.
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公开(公告)号：US10356969B2
公开(公告)日：2019-07-16
申请号：US15297714
申请日：2016-10-19
Inventor： Koji Watanabe , Hiroyuki Fujiwara , Shinji Yamamoto
Abstract: A recognition mark which is formed on a tape retaining cover which retains a carrier tape, which holds components in pockets, in relation to a sprocket with which the tape feeder is provided, and the component or the pocket which is positioned at a suction position through an opening which is formed in the tape retaining cover are recognized. Based on recognition results, tape feed positional correction for positioning the suction target component at the suction position is performed such that the component, which is adjacent on an upstream side in a tape feed direction to the component which is positioned at the suction position, is not exposed by greater than or equal to a predetermined amount from the opening.
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Patent Agency Ranking
公开(公告)号：US10349569B2
公开(公告)日：2019-07-09
申请号：US14769311
申请日：2014-02-20
Inventor： Shinji Yamamoto , Hiroyuki Fujiwara
Abstract: A component mounting device which mounts on a board electronic components including a fitting component to be attached by a mechanical fitting or engagement to a to-be-attached part formed in the board. The component mounting device includes a moving and mounting head which holds and takes out the fitting component by a holding unit from a component supply part to move and mount the fitting component on the to-be-attached part of the board, and a pressing head which presses the fitting component that is moved and mounted on the to-be-attached part by a pressing unit to attach the fitting component to the to-be-attached part.
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公开(公告)号：US10165716B2
公开(公告)日：2018-12-25
申请号：US14773097
申请日：2014-03-03
Inventor： Toshihiko Nagaya , Hiroyuki Fujiwara , Shigeo Ogata , Yoshinori Konda , Yoichi Makino , Shinji Yamamoto , Shuuichi Kubota , Kimio Iizuka , Koji Sakurai
Abstract: A substrate conveyance mechanism that includes conveyance units and a working area length change part to easily change the types of substrates to allow substrates of different lengths to be selected to mount electronic components onto the substrate. The conveyance units include a working area for substrates having different length that are conveyed from a stand-by area, an area length of the working area that is variable in accordance with the length of the substrate, and a stand-by unit corresponding to a stand-by area for the substrate to be carried in to the working area. The working area length change part changes an interval between a commonly used first pulley and one of a plurality of second pulleys selectively used in accordance with the area length of the working area by changing a belt winding path of a conveyance belt wound on the pulleys in the working unit.
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公开(公告)号：US09615494B2
公开(公告)日：2017-04-04
申请号：US14773052
申请日：2014-03-03
Inventor： Toshihiko Nagaya , Hiroyuki Fujiwara , Shigeo Ogata , Yoshinori Konda , Yoichi Makino , Shinji Yamamoto , Shuuichi Kubota , Kimio Ilzuka , Koji Sakurai
CPC classification number: H05K13/0061 , H05K13/04
Abstract: A substrate conveyance mechanism includes conveyance units and a clamp mechanism. The conveyance units include a working unit corresponding to a working area for types of substrates having different sizes of length taken as objects, an area length of the working area being variable in accordance with the sizes of length, and a stand-by unit corresponding to a stand-by area for the substrate to be carried-in to the working area. The clamp members include commonly used first clamp members and second clamp members which are attachable and detachable and are selectively used in accordance with the sizes of length of the plurality of types of substrates in addition to the first clamp members.
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公开(公告)号：US10701849B2
公开(公告)日：2020-06-30
申请号：US15595981
申请日：2017-05-16
Inventor： Shinji Yamamoto , Koji Sakurai , Hiroyuki Fujiwara
Abstract: A lower surface of a board arranged at a working position is supported by a board supporter, and heights of a plurality of portions of the lower surface of the board are measured by a plurality of height measuring instruments attached to the board supporter. A component is installed on the board by control of a height of the installation of the component by an installation head and with respect to the board, which has the lower surface supported by the board supporter, being performed based on the height of the plurality of portions of the lower surface of the board measured by the plurality of height measuring instruments.
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公开(公告)号：US10477748B2
公开(公告)日：2019-11-12
申请号：US14769227
申请日：2014-02-20
Inventor： Shinji Yamamoto , Hiroyuki Fujiwara
IPC: H05K13/04
Abstract: A component mounting device that mounts on a board a fitting component to be attached by a mechanical fitting or engagement to a to-be-attached part formed in the board. The component mounting device includes a mounting head which carries out a moving and mounting operation in which the fitting component is taken out from a component supply part by sucking and holding the fitting component, moved and mounted on the to-be-attached part, and pressed by a first load, and a pressing operation in which the fitting component is pressed by a second load larger than the first load, and a head control part which controls the mounting head to suck and hold a neighborhood of a central portion of an upper surface of the fitting component in the moving and mounting operation, and to press a press part corresponding to the to-be-attached part in the pressing operation.
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