SPUTTERING METHOD
    2.
    发明申请
    SPUTTERING METHOD 审中-公开

    公开(公告)号:US20190169738A1

    公开(公告)日:2019-06-06

    申请号:US16205166

    申请日:2018-11-29

    Abstract: To provide a sputtering method as a reactive sputtering method of forming a thin film by allowing a target material to react with a gas, in which film deposition conditions are narrowed down from an existing period of nitrogen radicals by focusing on a nitriding process in thin-film forming processes when the thin film is formed by pulsing a waveform of electric current from a DC power supply at the time of generating plasma and applying the electric current to the target material.

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