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公开(公告)号:US20200255977A1
公开(公告)日:2020-08-13
申请号:US16637553
申请日:2018-11-21
Inventor: TAKAHIDE HIRASAKI , DAISUKE SUETSUGU , TAKAFUMI OKUMA
IPC: C30B29/38 , C30B29/42 , C30B29/44 , C30B29/20 , C30B29/36 , C30B29/22 , C30B25/18 , C30B25/06 , C23C14/34 , C23C14/06
Abstract: A composite nitride-based film structure includes a bulk single crystal, a plurality of nitride microcrystals, and an amorphous nitride thin film. The plurality of nitride microcrystals is provided on the bulk single crystal, and has a specific orientation relationship with a crystal structure of the bulk single crystal. The nitride thin film is provided on the bulk single crystal, surrounds the nitride microcrystal, and covers a surface of the bulk single crystal.
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公开(公告)号:US20190169738A1
公开(公告)日:2019-06-06
申请号:US16205166
申请日:2018-11-29
Inventor: TAKAFUMI OKUMA , DAISUKE SUETSUGU , TAKAHIDE HIRASAKI
Abstract: To provide a sputtering method as a reactive sputtering method of forming a thin film by allowing a target material to react with a gas, in which film deposition conditions are narrowed down from an existing period of nitrogen radicals by focusing on a nitriding process in thin-film forming processes when the thin film is formed by pulsing a waveform of electric current from a DC power supply at the time of generating plasma and applying the electric current to the target material.
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