公开(公告)号：US20190229029A1

公开(公告)日：2019-07-25

申请号：US16245168

申请日：2019-01-10

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： HIDEKI NIIMI ,  TATSUO SASAOKA

IPC: H01L23/367 ,  H01L23/498 ,  H01L23/00

Abstract: A semiconductor device with small variations in high frequency characteristics by suppressing variations in impedance while maintaining high heat radiation is provided. The semiconductor device including a semiconductor package having two terminals, a wiring board having an opening at which the semiconductor package is positioned and having two electrodes connected to the two terminals and a heat sink fixing the semiconductor package in which a center of the semiconductor package is decentered with respect to a center of the opening is used. Also, the semiconductor device in which a center of the two electrodes is decentered from a center of the opening is used.

公开(公告)号：US20190333707A1

公开(公告)日：2019-10-31

申请号：US16299786

申请日：2019-03-12

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： SHINJI ISHITANI ,  TATSUO SASAOKA ,  RENKI YAMAZAKI

IPC: H01G9/15 ,  H01G9/025 ,  H01G9/042 ,  H01G9/07 ,  H01G9/10

Abstract: An electronic component includes an electronic element that includes a lead portion, a sealing body that seals the electronic element in a state where an end portion of the lead portion is exposed, a first current collector that is formed on the sealing body and is connected to the end portion, and a first terminal that includes a first portion which is sealed in the sealing body and is connected to the first current collector.

公开(公告)号：US20170341188A1

公开(公告)日：2017-11-30

申请号：US15479141

申请日：2017-04-04

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： SHINJI ISHITANI ,  MANABU GOKAN ,  TATSUO SASAOKA

IPC: B23K35/02 ,  B23K35/26 ,  B23K1/002

CPC classification number: B23K35/025 ,  B23K1/0016 ,  B23K1/002 ,  B23K35/262

Abstract: To provide a solder material capable of performing soldering with high reliability while suppressing materials other than a solder metal to remain inside the solder after the soldering. Coil-shaped carbons are heated by electromagnetic waves by using a solder material in which coil-shaped carbons of 0.5 weight % to 1.5 weight % with respect to a weight of a solder paste are mixed, thereby performing soldering by heating the solder material itself.