-
Patent Agency Ranking
公开(公告)号：US20240262550A1
公开(公告)日：2024-08-08
申请号：US18637720
申请日：2024-04-17
Inventor： HIROKI KOBAYASHI , NAOKI AZUMA , CHIKARA TAKATA , YUZO ASANO , TORU CHIKUMA , HIROSHI SATOH
CPC classification number: B65B15/04 , B65G47/68 , H05K13/02 , H05K13/0417
Abstract: A component mounting system including: a component mounting device group in which a plurality of component mounting devices that mount components supplied to a board transported in from an upstream side by a tape feeder and transport out the board to a downstream side, and cut a carrier tape after supplying the components by a cutter device and discharge scraps of carrier tape, are installed on a floor surface while being arranged in a direction of conveying the board; a main conveyor that is installed along an arrangement direction of the plurality of component mounting devices in a region on the floor surface under the component mounting device group, and transports the scraps of carrier tape discharged from each of the plurality of component mounting devices; and a scraps storage that is installed outside the region and stores the scraps of carrier tape transported by the main conveyor.
-
公开(公告)号：US20230331413A1
公开(公告)日：2023-10-19
申请号：US18339403
申请日：2023-06-22
Inventor： HIROKI KOBAYASHI , NAOKI AZUMA , CHIKARA TAKATA , YUZO ASANO , TORU CHIKUMA , HIROSHI SATOH
Abstract: A component mounting system including: a component mounting device group in which a plurality of component mounting devices that mount components supplied to a board transported in from an upstream side by a tape feeder and transport out the board to a downstream side, and cut a carrier tape after supplying the components by a cutter device and discharge scraps of carrier tape, are installed on a floor surface while being arranged in a direction of conveying the board; a main conveyor that is installed along an arrangement direction of the plurality of component mounting devices in a region on the floor surface under the component mounting device group, and transports the scraps of carrier tape discharged from each of the plurality of component mounting devices; and a scraps storage that is installed outside the region and stores the scraps of carrier tape transported by the main conveyor.
-
公开(公告)号：US20230146855A1
公开(公告)日：2023-05-11
申请号：US18150874
申请日：2023-01-06
Inventor： HIROKI KOBAYASHI , NAOKI AZUMA , CHIKARA TAKATA , YUZO ASANO , TORU CHIKUMA , HIROSHI SATOH
Abstract: A component mounting system including: a component mounting device group in which a plurality of component mounting devices that mount components supplied to a board transported in from an upstream side by a tape feeder and transport out the board to a downstream side, and cut a carrier tape after supplying the components by a cutter device and discharge scraps of carrier tape, are installed on a floor surface while being arranged in a direction of conveying the board; a main conveyor that is installed along an arrangement direction of the plurality of component mounting devices in a region on the floor surface under the component mounting device group, and transports the scraps of carrier tape discharged from each of the plurality of component mounting devices; and a scraps storage that is installed outside the region and stores the scraps of carrier tape transported by the main conveyor.
-
公开(公告)号：US20220127028A1
公开(公告)日：2022-04-28
申请号：US17647196
申请日：2022-01-06
Inventor： HIROKI KOBAYASHI , NAOKI AZUMA , CHIKARA TAKATA , YUZO ASANO , TORU CHIKUMA , HIROSHI SATOH
Abstract: A component mounting system including: a component mounting device group in which a plurality of component mounting devices that mount components supplied to a board transported in from an upstream side by a tape feeder and transport out the board to a downstream side, and cut a carrier tape after supplying the components by a cutter device and discharge scraps of carrier tape, are installed on a floor surface while being arranged in a direction of conveying the board; a main conveyor that is installed along an arrangement direction of the plurality of component mounting devices in a region on the floor surface under the component mounting device group, and transports the scraps of carrier tape discharged from each of the plurality of component mounting devices; and a scraps storage that is installed outside the region and stores the scraps of carrier tape transported by the main conveyor.
-
公开(公告)号：US20200346800A1
公开(公告)日：2020-11-05
申请号：US16930458
申请日：2020-07-16
Inventor： HIROKI KOBAYASHI , NAOKI AZUMA , CHIKARA TAKATA , YUZO ASANO , TORU CHIKUMA , HIROSHI SATOH
Abstract: There is provided a component mounting system including: a component mounting device group in which a plurality of component mounting devices that mount components supplied to a board transported in from an upstream side by a tape feeder and transport out the board to a downstream side, and cut a carrier tape after supplying the components by a cutter device and discharge scraps of carrier tape, are installed on a floor surface while being arranged in a direction of conveying the board; a main conveyor that is installed along an arrangement direction of the plurality of component mounting devices in a region on the floor surface under the component mounting device group, and transports the scraps of carrier tape discharged from each of the plurality of component mounting devices; and a scraps storage that is installed outside the region and stores the scraps of carrier tape transported by the main conveyor.
-
-
-
-
Search Results
5
records
(took 0.012 seconds)
