公开(公告)号：US20220057211A1

公开(公告)日：2022-02-24

申请号：US17415340

申请日：2020-02-04

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Koichiro NAKASHIMA ,  Takashi UCHIDA ,  Yusuke NAKAMURA ,  Hideki UEDA ,  Naruhito NODA ,  Toshitsugu KONISHI ,  Toshio YAMAZAKI

IPC: G01C19/5783 ,  G01C19/5684 ,  B81B7/00

Abstract: A sensor device includes a sensor element, a substrate, and a bonding wire. Over the substrate, provided is the sensor element. The bonding wire forms at least part of a connection path that electrically connects the sensor element and the substrate together. The bonding wire is provided to connect two connection surfaces that intersect with each other.

公开(公告)号：US20230204442A1

公开(公告)日：2023-06-29

申请号：US17919470

申请日：2021-02-08

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Takeshi MORI ,  Toshio YAMAZAKI ,  Isao HATTORI ,  Hirotsugu SUZUKI

IPC: G01L1/26 ,  G01L25/00 ,  G01P21/00

CPC classification number: G01L1/26 ,  G01L25/00 ,  G01P21/00

Abstract: A sensor system includes a sensor element, a signal processing circuit, and a pseudo-signal correction circuit. The sensor element outputs an electric signal corresponding to an external force. The signal processing circuit converts the electric signal coming from the sensor element into a signal having a certain signal format and then outputs the signal thus converted. The pseudo-signal correction circuit corrects a pseudo-signal outputted by the sensor element. When receiving a test signal, the sensor element performs a self-diagnosis based on the test signal and then outputs the pseudo-signal, which represents a result of the self-diagnosis. The pseudo-signal correction circuit corrects the pseudo-signal based on environment information about an environment where at least one of the sensor element or the signal processing circuit is located.

公开(公告)号：US20220364864A1

公开(公告)日：2022-11-17

申请号：US17774381

申请日：2020-11-06

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Hideki UEDA ,  Yusuke NAKAMURA ,  Koichiro NAKASHIMA ,  Takashi UCHIDA ,  Toshio YAMAZAKI ,  Hiroyuki FUJII ,  Chikara NARA

IPC: G01C19/5783 ,  B81B7/00

Abstract: A sensor device includes a sensor element, a supporting member, a substrate, and a bonding wire. The supporting member is electrically connected to the sensor element. The substrate is electrically connected to the supporting member. The bonding wire forms at least part of a connection path that electrically connects the sensor element and the supporting member together. The substrate and an installation member on which the sensor element is installed intersect with each other. The sensor element and the supporting member are separated from each other.

公开(公告)号：US20150300820A1

公开(公告)日：2015-10-22

申请号：US14745686

申请日：2015-06-22

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Takashi UCHIDA ,  Toshio YAMAZAKI ,  Tomohiro MITANI

IPC: G01C19/5607

CPC classification number: G01C19/5607 ,  B81B7/0016 ,  B81B2201/0242 ,  G01C19/5628 ,  G01C19/574 ,  G01C19/5769

Abstract: A placing member is configured to be supported from an outside by a terminal electrically connected to a terminal electrode, and an X-axis-direction extended portion, a Y-axis-direction extended portion, and a Z-axis-direction extended portion are provided in the terminal. This configuration provides an angular velocity sensor, in which a problem such that Y-axis-direction and Z-axis-direction vibrations applied from the outside cannot be damped is eliminated, and all the vibrations in three axis directions can be damped.

Abstract translation: 配置构件通过与端子电连接的端子从外部被支撑，并且X轴方向延伸部分，Y轴方向延伸部分和Z轴方向延伸部分是 在终端提供。 这种结构提供了一种角速度传感器，其中消除了从外部施加的Y轴方向和Z轴方向振动不能被阻尼的问题，并且可以抑制三轴方向上的所有振动。