Abstract:
Methods for fabricating MEMS tuning fork gyroscope sensor system using silicon wafers. This provides the possibly to avoid glass. The sense plates can be formed in a device layer of a silicon on insulator (SOI) wafer or in a deposited polysilicon layer in a few examples.
Abstract:
The present disclosure relates to an inertia measurement module for an unmanned aircraft, which comprises a housing assembly, a sensing assembly and a vibration damper. The vibration damper comprises a first vibration-attenuation cushion; and the sensing assembly comprises a first circuit board, a second circuit board and a flexible signal line for connecting the first circuit board and the second circuit board. An inertia sensor is fixed on the second circuit board, and the first circuit board is fixed on the housing assembly. The inertia measurement module further comprises a weight block, and the second circuit board, the weight block, the first vibration-attenuation cushion and the first circuit board are bonded together. The present disclosure greatly reduces the influence of the operational vibration frequency of the unmanned aircraft on the inertia sensor and improves the measurement stability of the inertia sensor.
Abstract:
A physical quantity sensor includes a sensor element, an integrated circuit that is electrically connected to the sensor element, and a ceramic package (base body) on which the integrated circuit is mounted. A first conductor pattern (interconnection pattern) for electrical connection with the outside is provided on one surface of the ceramic package. A second conductor pattern is provided to be electrically connected to the interconnection pattern. The second conductor pattern includes an interconnection pattern that passes through the inside of the ceramic package, and a metallized region that is exposed on the other surface of the ceramic package. The interconnection pattern is longer than a distance between the one surface and the other surface of the ceramic package.
Abstract:
A physical quantity sensor includes a detection unit outputting a detection signal corresponding to a vibration of a vibrating element in an angular velocity sensor, and a self-diagnostic unit self-diagnosing a detection environment of an acceleration sensor and the angular velocity sensor on a basis of the detection signal outputted by the detection unit.
Abstract:
System and method can support a measurement module on a movable object. The measurement module includes a first circuit board with one or more sensors. Additionally, the measurement module includes a weight block assembly, wherein the weight block assembly is configured to have a mass that keeps an inherent frequency of the measurement module away from an operation frequency of the movable object. Furthermore, said first circuit board can be disposed in an inner chamber within the weight block assembly.
Abstract:
A physical quantity sensor includes a sensor element, an integrated circuit that is electrically connected to the sensor element, and a ceramic package (base body) on which the integrated circuit is mounted. A first conductor pattern (interconnection pattern) for electrical connection with the outside is provided on one surface of the ceramic package. A second conductor pattern is provided to be electrically connected to the interconnection pattern. The second conductor pattern includes an interconnection pattern that passes through the inside of the ceramic package, and a metallized region that is exposed on the other surface of the ceramic package. The interconnection pattern is longer than a distance between the one surface and the other surface of the ceramic package.
Abstract:
A physical quantity sensor includes a sensor element, an integrated circuit that is electrically connected to the sensor element, and a ceramic package (base body) on which the integrated circuit is mounted. A first conductor pattern (interconnection pattern) for electrical connection with the outside is provided on one surface of the ceramic package. A second conductor pattern is provided to be electrically connected to the interconnection pattern. The second conductor pattern includes an interconnection pattern that passes through the inside of the ceramic package, and a metallized region that is exposed on the other surface of the ceramic package. The interconnection pattern is longer than a distance between the one surface and the other surface of the ceramic package.
Abstract:
A vibrator element includes a pair of first and second drive vibrating arms that extend in opposite directions from a base portion; a first weight that is spaced from a tip of at least one of the first and second drive vibrating arms toward the base portion and is provided in a first region of the at least one of the drive vibrating arms; and a second weight that is provided in a second region that is a region between a tip of the first weight and the tip of the at least one of the drive vibrating arms. When an area of the first region is represented as A1, a mass of the first weight is represented as B1, an area of the second region is represented as A2, and a mass of the second weight is represented as B2, B1/A1>B2/A2 is established.
Abstract:
A thin film piezoelectric element according to the present invention includes a potassium sodium niobate thin film having a structure in which a plurality of crystal grains are present in a film thickness direction; and a pair of electrode films sandwiching the potassium sodium niobate thin film. When the potassium sodium niobate thin film is divided into three regions of the same thickness in the film thickness direction and average crystal grain sizes A1, A2, and A3 of the respective regions are determined, a ratio m/M of the smallest average crystal grain size m among A1, A2, and A3 to the largest average crystal grain size M among A1, A2, and A3 is 10% to 80%. The region having the smallest average crystal grain size m lies next to one of the pair of electrode films.
Abstract translation:根据本发明的薄膜压电元件包括具有多个晶粒在膜厚度方向上存在的结构的铌酸钾钠薄膜; 和一对夹着铌酸钾钠薄膜的电极膜。 当铌酸钾薄膜在膜厚度方向上分为相同厚度的三个区域并确定各个区域的平均晶粒尺寸A1,A2和A3时,最小平均晶粒的比率m / M A1,A2和A3之间的尺寸m为A1,A2和A3之间的最大平均晶粒尺寸M为10%至80%。 具有最小平均晶粒尺寸m的区域紧邻该对电极膜中的一个。
Abstract:
A sensor element has drive vibrating arms drive-vibrating by energization, adjustment vibrating arms vibrating with the drive vibrations of the drive vibrating arms, detection electrodes outputting charge in response to physical quantities applied to the drive vibrating arms, first electrodes provided on the adjustment vibrating arms, electrically connected to the detection electrodes, and outputting charge with the vibrations of the adjustment vibrating arms, and a pair of second electrodes provided on the adjustment vibrating arms, electrically connected to a pair of detection electrodes, and outputting charge having an opposite polarity to that of the first electrodes with the vibrations of the adjustment vibrating arms.